Industry Directory | Manufacturer
Semiconductor package substrate manufacturer, IC substrate manufacturer
Industry Directory | Manufacturer / Other
Gen Pack Assembly is a contract electronics manufacturer providing PCB assembly, testing, and box-build integration for your mid volume & high mix productions. A trusted partner for over 25 years, Gen Pack is proudly ISO:9001
- Designed for low-end LSI (Large-Scale Integration) device testing. - Per-pin architecture provides high flexibility and customization in test configurations. - Operates at a maximum frequency of 20 MHz. - Supports up to 512 input/output pins, suita
New Equipment | Solder Materials
Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,
Electronics Forum | Fri Oct 30 10:36:26 EDT 2009 | richie_puthotta
Hi, I see a huge solder mask shift on chip comp pads. This would result in mid-chip solder balls or solder beads. Overall, the solder mask workmanship is not acceptable. Mask is on pad.
Electronics Forum | Thu Jul 19 08:00:03 EDT 2001 | doctord
Solder balls or mid chip beads? Remember IPC classification for Class 2 allows mid chip beads encapsulated in flux. Usually on R's and C's first thing I would do is verify .006 laser stencil 10% reduction and the most critical, The paste must be on t
Industry News | 2022-08-14 14:18:23.0
The following statement is issued by John Mitchell, IPC president and CEO, to comment on President Biden's signature today on the "CHIPS and Science Act" in Washington, D.C.:
Industry News | 2018-12-08 03:22:25.0
Electronic Components, Parts and Their Function
Parts & Supplies | Pick and Place/Feeders
JUKI HN001490000 CLAMP FILTER(L) FUJINTAI TECHNOLOGY CO.,LTD JUKI HN00149000A CLAMP FILTER www.fujintai.com JUKI HN00167000A SURGE ABSORBER FUJINTAI TECHNOLOGY CO.,LTD JUKI HN001960000 NOISE FILTER www.fujintai.com JUKI HN001970000 SURGE ABSORBER
Shenzhen Zhuomao Technology Co., Ltd. Specialized in BGA/SMT Rework, Reballing, SMD LED (LED Display Module) Repair, TV LCD Laser Repair, X-Ray Inspection Machine Since 2005. We design and development of customized Non-standard BGA Rework System in
This is the first in a series of 10-minute videos to introduce new users to the basics of machine vision technology. In this video, users will learn what machine vision is, how it is used in factory automation, and its four most common applications.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Career Center | Duluth, Georgia USA | Management,Sales/Marketing
Over 20 years of experience selling high tech capital equipment for manufacturing. ��Accomplished in territory management, regional sales management, and key account management ��Proficient at managing several projects, coordinating engineering deve
Career Center | Bangalore-560026, Karnataka India | Engineering,Maintenance,Technical Support
New Product Introduction & Product dovelopment
SMTnet Express, December 7, 2016, Subscribers: 27,507, Companies: 15,035, Users: 41,441 Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling Katherine Wilkerson, Ian J. Wilding, Michael Carter, Daniel Buckland
SMTnet Express, September 24, 2015, Subscribers: 23,507, Members: Companies: 14,658, Users: 39,014 Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices Dick Pang, Weifeng Liu, Anwar Mohammed, Elissa Mckay, Teresita Villavert and Murad
| https://ipcapexexpo.org/sponsors
IPC APEX Trade Show Subcommittee Chairman, Mark Ogden, ASM Assembly Systems Jason Spera, Aegis Industrial Software Corporation Chip King, Fuji America Corporation Brent Fischthal, Koh Young Technology Inc
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Abstract 20-4 0.4 mm SOLDER BALL PITCH CHIP SCALE PACKAGING AND DROP TEST PERFORMANCE Geun Sik Kim and Dong Sik Kim Abstract 20-4 AN EXPERIMENTAL STUDY OF A COMPONENTS TERMINATION FINISH CONVERSION PROCESS: THE ROBOTIC STRIPPING AND SOLDER DIPPING PROCESS G
