Industry Directory | Manufacturer
Since 1985, Unit Design has been a leading manufacturer of soldering equipment, lead tinning systems and batch defluxing systems. We are commited to innovative technology, reliable equipment and great customer service.
Electronics manufacturing services, populate pcb with electronics components, cable harness assembly, systems assembly, consignments and turn key.
New Equipment | Rework & Repair Equipment
Standard Flat Reamer/Straight Fork Tip (SH-20A) (8") Description: Straight Flat Reamer Miniature (left) & Standard (right) Tools with the Miniature Straight Flat Reamer: SH-20C, SH-20E Tools with the Standard Straight Flat Reamer: SH-20A
New Equipment | Rework & Repair Equipment
Angled Flat Reamer Miniature (left) & Standard (right) Tools with the Miniature Angled Flat Reamer: SH-20D Tools with the Standard Angled Flat Reamer: SH-20B Applications 30 degree bend at the tip allows access to more difficult areas. Us
Used SMT Equipment | AOI / Automated Optical Inspection
Hello and thank you for your interest in our MVP Machine Vision Products AOI Machines For Sale. We have a total of (4) MVP Automated Optical Inspection Machines and (2) Inspection Repair Stations.. They were taken off line due to company closer. All
Used SMT Equipment | Soldering - Selective
Configuration: Universally Adjustable Tooling Carrier Inerted Nitrogen System Lead Free Capability (Titanium solder pot and pump assembly) Solder Wire Feeder with Solder bath level sensor Drop Jet Fluxer Programming Camera
Industry News | 2016-09-01 12:07:57.0
A new class has been developed to teach EMS providers and others the basics of wire harness assembly techniques. This class goes along with the popular IPC-A-620 Wire and Cable Harness Assembly Acceptance standards.
Technical Library | 2021-11-26 14:34:07.0
The use of desiccant bags filled with Silica Sand and or Clay beads used in conjunction with a Moisture Barrier Bag to control moisture for storage of printed circuit boards has long been an accepted practice and standard from both JEDEC and IPC organizations. Additionally, the use heated ovens for baking off moisture using the evaporation process has also been a long#2;standing practice from these organizations. This paper on alternative drying methods will be accompanied by completed independent, unbiased tests conducted by Vinny Nguyen, an engineering student (now graduated) from San Jose State University. The accompanied paper will examine the performance levels of different technologies of desiccant bags to control moisture in enclosed spaces. The tests and equipment set were reviewed by an engineer and consultant to the Lockheed Martin Aerospace Division and the IPC - TM-650 2.6.28 test method was review by engineer from pSemi. The tests were designed to mimic performance tests outlined in Mil Spec 3464, which both IPC and JEDEC have adopted for their respective standards. The test examined variables including absorption capacity rates, weight gain and release of moisture back into the enclosed area. The presentation will also address and highlight: • Similarities of PCBs and Heavy Equipment as it applies to Inspections, Causes of Failure, Types of Corrosion and Moisture Collection Points. • Performance Attributes of Different Desiccant Technologies as it applies to shape, texture, change outs, labeling and regeneration. • Venn Diagram of Electromechanical Failure with the circles 1. Current 2. Contamination 3. Humidity Presentation Available
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
BEST, Inc. is an authorized IPC Training Center and offers the IPC-A-610C Certified Instructor Program. Students who complete the program are considered Class "A" Instructors and are qualified to teach the 2 day Worker Proficiency training and certif
http://www.ddmnovastar.com/stencil-printers - DDM Novastar Stencil Printers are designed for short to medium run PCB assembly. Ranging from manual to semi-automatic, these durable, easy-to-use systems provide repeatable, reliable results. Greatly r
Training Courses | | | IPC-A-610 Specialist (CIS)
The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies
Training Courses | | | IPC-A-610 Specialist (CIS)
The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies
Career Center | Warminster, Pennsylvania USA | Quality Control
Inspects electronic systems, assemblies, subassemblies, components, and parts for conformance to specifications and identify/implement corrective actions among production and other staff. The Inspector should have some experience with board Inspe
Career Center | Houston, Texas USA | Production
Electronic Assemblers / Solderers Temp to hire opportunity! $11 - $13/hour Job Responsibilities 1.) Solder rf, gps and gsm antenna, ps pigtail, fiber leds, buzzer 2.) IPC-610 or mil spec experience a plus 3.) Glue units together 4.) Cut open
Career Center | San Diego, California USA | Engineering,Management,Quality Control,Research and Development
ENGINEER, NPI, MANUFACTURING ASSEMBLY PROCESSES, 23 years experience #11;SOLDERING, MTLS & PROCESS ENGINEER, CIRCUIT CARD ASSEMBLY, ESDS PROGRAM MANAGER, QUALITY ENGINEER. Former Mil Spec INSTRUCTOR/EXAMINER (Cat C),
Career Center | Jackson, Georgia USA | Production
MARIE M. FLANAGAN 138 Katy Lake Rd. Jackson, GA 30233 E-Mail: escape0827@aol.com (770) 775-3498 October 3, 2002 Dear Sir, I have worked in the electronics manufacturing field for over fifteen years. Although I do not have a degree, I am a high
An Effective Design of Experiment Strategy to Optimize SMT Processes An Effective Design of Experiment Strategy to Optimize SMT Processes It is now widely accepted that using designed experiments is the most effective way to optimize surface mount
| https://www.eptac.com/soldertip/soldertip-41-j-std-001-revision-e-is-here-order-it-now/
. J-STD-001E is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for lead free manufacturing, in addition to easier to More SolderTips SolderTip #36
Blackfox Training Institute, LLC | https://www.blackfox.com/wp-content/uploads/2017/04/BlackFox_Sharon.pdf
• General soldered connection acceptance requirements (including lead free) • Machine and reflow soldering process requirements • Test methods and related standards
