New SMT Equipment: mirtec false call offset (4)

Koh Young KY8080 3D SPI

Koh Young KY8080 3D SPI

New Equipment | Test Equipment

Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808

Qersa Technology Co.,ltd

Hanwha SM482 Plus SMT Assembly Line

Hanwha SM482 Plus SMT Assembly Line

New Equipment | Test Equipment

Hanwha SM482 Plus SMT Assembly Line Hanwha SM482 Plus SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed:30000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young SPI, Automatic Pick and place mach

Qersa Technology Co.,ltd

Electronics Forum: mirtec false call offset (41)

YesTech F1 AOI false calls and misses

Electronics Forum | Thu Apr 19 20:01:30 EDT 2012 | eadthem

some things to consider, Is there flux on the board. are there finger prints on the tops of parts. Is the board warped at the V score from reflow Is the board shifting in the machine during inspection. These are the issues we have had with our mir

FALSE CALL REDUCTION

Electronics Forum | Wed Aug 07 17:05:41 EDT 2024 | pradeep14

We are a high mix low or middle volume production. We are using 3D AOI MIRTEC. How to reduce the false cals. Every batch we are adding more samples to the program but we can't able to reduce the false call ratings. Suggest how to control the FALSE ca

Used SMT Equipment: mirtec false call offset (4)

JUKI KE 2070L

JUKI KE 2070L

Used SMT Equipment | Pick and Place/Feeders

  Dear Customer,   We have the machine as below for sales,   Model: KE 2070 L   Vintage: 2010   No Feeder   Please contact us if you are interested.   Regards   Michael     var LEO_HIGHLIGHTS_INFINITE_

Neko Automation (S) Pte Ltd

Speedline MPM UP2000HiE

Speedline MPM UP2000HiE

Used SMT Equipment | Screen Printers

  Dear Customer,   We are please to offer you our machine as below:   Model: MPM UP2000HiE -- 2 units Software Window NT Vintage: 2005 Flow Direction: Left to Right / Right to Left Rail Type: Front Fixed   C/W Balance Controlled

Neko Automation (S) Pte Ltd

Industry News: mirtec false call offset (14)

National Circuit Assembly Offers Authentic Measurement and Inspection with New 3D SPI System

Industry News | 2020-09-22 11:05:29.0

National Circuit Assembly has purchased and installed a PARMI HS60L 3D Solder Paste Inspection (SPI) system. With the most reliable and accurate 3D data, NCA offers reliable, accurate inspection.

National Circuit Assembly

3-D solder paste inspection with Process Uplink function: More than just defect detection

Industry News | 2012-04-06 19:44:17.0

In SMT electronic assembly production, 3-D SPI has established itself as the additional inspection gate to complement optical or X-ray inspection.

Viscom AG

Express Newsletter: mirtec false call offset (707)

Partner Websites: mirtec false call offset (15)


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Blackfox IPC Training & Certification

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