Electronics Forum | Fri May 01 18:01:04 EDT 1998 | Peter Soland
Has anyone experienced profile related microbridging under 0402 capacitors in the past. We use a Sn46Pb46Bi8 paste, 178 degree C L.T.. Double sided board, 2 per panel, 6.5" x 5", convection oven. Profile data; thermalcouples @ components showing 200
Electronics Forum | Wed Jun 20 12:07:13 EDT 2001 | Steve
I would suggest getting a copy of IPC-SM-782A, Surface Mount Design and Land Pattern Standard, and IPC-7525 Stencil Design Guidelines. My experience is that reflow does not cause tombstoning very often. Pad and land design, paste volume, and placemen
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