Electronics Forum: mydata measure board out of bounds (25)

how to measure an assembly cost of a board

Electronics Forum | Wed Jul 30 07:22:17 EDT 2008 | davef

Not sure what software you have, but somehow you must be accumulating costs by process and you probably know [or can figure-out] how many boards you processed. From this, you can calculate a standard cost of a process. Continuing, there is a thread,

f-mnt 9 board level out of range MYDATA MY9 . How to solve

Electronics Forum | Wed Aug 23 11:06:57 EDT 2017 | cyber_wolf

Bad Z-force sensor or it is checking the board height in a hole.

Used SMT Equipment: mydata measure board out of bounds (4)

Mydata MY300SX-11

Mydata MY300SX-11

Used SMT Equipment | Pick and Place/Feeders

Software Version 4.2.4e Electrical two-pole test Electrical transistor test Shared databases Hydra Electrical measurement Hydra high speed Line mode Fast place sequence Hydra large component range Hydra fine pitch In/Out conveyor board trai

Baja Bid

Mydata MY300 SX-11

Used SMT Equipment | Pick and Place/Feeders

2018 Mycronic My300 SX-11 Pick and Place Make: Mycronic Model: MY300SX-11 Vintage: 2018 Description: SMT Pick & Place Details: 2 heads (midas & hydra) 11 bay pick and place Electrical 2 Pole Test Electrical Transister Test Shared Data bases Hydra El

Baja Bid

Industry News: mydata measure board out of bounds (41)

Mirtec To Premier Its Complete Line of Technologically Advanced Automated Optical Inspection Systems at SMTAI 2010

Industry News | 2010-10-01 00:32:52.0

MIRTEC, “The Global Leader in Inspection Technology”, announced that it will premier its complete line of inspection systems at in booth #7326 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

MIRTEC Corp

MIRTEC To Premier Its Complete Line of Technologically Advanced Automated Optical Systems at IPC Electronics Midwest 2010

Industry News | 2010-09-01 22:03:07.0

MIRTEC, "The Global Leader in Inspection Technology", announced that it will premier its complete line of inspection systems at in booth #7617 at the upcoming IPC Electronics Midwest Conference & Exhibition, scheduled to take place September 28-30, 2010 at the Donald E. Stevens Convention Center in Rosemont, IL.

MIRTEC Corp

Parts & Supplies: mydata measure board out of bounds (7)

MPM Sensor circuit breakers of MPM

MPM Sensor circuit breakers of MPM

Parts & Supplies | Screen Printers

Product Name: CA-1115-02 SC300A-500FP sensor circuit breakers Part Number: CA-1115-02; SC300A-500FP Description: CA-1115-02; SC300A-500FP sensor circuit breakers Applicable models: AP Printing Presses CA-1115-02; SC300A-500FP circuit breake

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

MPM Sensor circuit breakers of MPM

MPM Sensor circuit breakers of MPM

Parts & Supplies | SMT Equipment

Sensor circuit breakers of MPM (CA-1115-02) Product Name: CA-1115-02 SC300A-500FP sensor circuit breakers Part Number: CA-1115-02; SC300A-500FP Description: CA-1115-02; SC300A-500FP sensor circuit breakers Applicable models: AP Printing Presses

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: mydata measure board out of bounds (4)

Analysis of Laminate Material Properties for Correlation to Pad Cratering

Technical Library | 2016-10-20 18:13:34.0

Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.

CALCE Center for Advanced Life Cycle Engineering

Contamination Profile of Printed Circuit Board Assemblies in Relation to Soldering Types and Conformal Coating

Technical Library | 2017-12-11 22:31:06.0

Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode setup. Localized extraction of residue was carried out using a commercial C3 extraction system. Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels.

Technical University of Denmark

Videos: mydata measure board out of bounds (1)

2018 Mycronic MY300SX-11 SMT Pick & Place Machine

2018 Mycronic MY300SX-11 SMT Pick & Place Machine

Videos

Software Version 4.2.4e Electrical two-pole test Electrical transistor test Shared databases Hydra Electrical measurement Hydra high speed Line mode Fast place sequence Hydra large component range Hydra fine pitch In/Out conveyor board trai

Baja Bid

Events Calendar: mydata measure board out of bounds (1)

SMTA Webinar: Development of Wireless Strain Measurement for Printed Circuit Board

Events Calendar | Mon Feb 19 00:00:00 EST 2024 - Mon Feb 19 00:00:00 EST 2024 | ,

SMTA Webinar: Development of Wireless Strain Measurement for Printed Circuit Board

Surface Mount Technology Association (SMTA)

Career Center - Resumes: mydata measure board out of bounds (1)

Process Engineering/Maintenance Technician

Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control

• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat

Express Newsletter: mydata measure board out of bounds (1091)

Partner Websites: mydata measure board out of bounds (497)

Understanding Bare Board Inspection: An Essential Quality Control Measure

| https://www.eptac.com/blog/understanding-bare-board-inspection-an-essential-quality-control-measure

.   Bare Board Inspection in the Broader Context of PCB Manufacturing and Quality Control Bare board inspection, while an essential quality control measure in its own right, does not function in isolation

Mydata spare parts Archives - Page 4 of 4 - Lewis and Clark, Inc.

Lewis & Clark | https://www.lewis-clark.com/product-tag/mydata-spare-parts/page/4/

: low to high Sort by price: high to low Out Of Stock Mydata WXB3 X Wagon Board Part No. L-029-0276-3B Make:  Mydata / Mycronic Part No

Lewis & Clark


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