Industry Directory | Manufacturer's Representative
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
Industry Directory | Manufacturer
CVD SILICON CARBIDE� from Advanced Materials
Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Electronics Forum | Tue Apr 22 12:33:35 EDT 2014 | barryg
No we have a battery spring that is soldered directly to a PCB (standard tin plated copper PCB). The Battery spring supplier (and I have no confirmation he makes them or buys them) claims they are tin plated. When trying to solder to them it is very
Electronics Forum | Fri Apr 25 14:49:34 EDT 2014 | isd_jwendell
If the tab is Sn plated, you can solder to it as long as your iron has enough power (watts). If you continue to have trouble then it probably isn't Sn plated.
Used SMT Equipment | Flexible Mounters
Product Name: Samsung multi-function SM421 chip mounter Product number: SM421 Detailed product introduction Samsung multi function SM421 chip mounter Mounting speed: 21K CPH /QFP (IPC9850) 5.5K CPH Chip (IPC9850) The corresponding components: Ma
Used SMT Equipment | SMT Equipment
Product Name: Samsung multi-function SM421 chip mounter Product number: SM421 Detailed product introduction Samsung multi function SM421 chip mounter Mounting speed: 21K CPH /QFP (IPC9850) 5.5K CPH Chip (IPC9850) The corresponding components: Ma
Industry News | 2013-07-22 09:54:27.0
GPD Global has introduced its new NCM5000 dispense pump for easy jetting. With only two wetted parts and no seals or springs to replace or adjust, field operation is simple.
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Parts & Supplies | SMT Equipment
PA Main Parts Part Name：NICKEL HYDRIC STORAGE BATTERY PART No：N9973GB6-005 Part Name：PIN PART No：1023810003 Part Name：VANE PART No：N45214022A Part Name：CAM FOLLOWER & LOCK-NUT PART No：N531CFH6RA Part Name：PIN PART No：102381000
Parts & Supplies | SMT Equipment
PA Main Parts Part Name：NICKEL HYDRIC STORAGE BATTERY (电池) PART No：N9973GB6-005 Part Name：PIN (MSH头部螺丝-长) PART No：1023810003 Part Name：VANE (真空泵碳片) PART No：N45214022A Part Name：CAM FOLLOWER & LOCK-NUT (支撑凸轮及螺母) PART No：N531CFH6RA Part Nam
Technical Library | 2013-01-18 02:42:14.0
ENIG (Electroless Nickel/Immersion Gold) is to deposit nickel gold plating which has good solderability, wear resistance , leveling appearance and small electric resistance. It included 4 steps that are pretreatment, immersion nickel, immersion gold and Post treatment...
Technical Library | 2014-08-07 15:13:44.0
Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. To avoid this issue, prior studies have indicated a maximum gold content of three weight percent. This study attempts to provide similar guidance for Pb-free (SAC305) solder. Standard surface mount devices were assembled with SnPb and SAC305 solder onto printed boards with various thicknesses of gold plating. The gold plating included electroless nickel immersion gold (ENIG) and electrolytic gold of 15, 25, 35, and 50 microinches over nickel. These gold thicknesses resulted in weight percentages between 0.4 to 7.0 weight percent.
Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Events Calendar | Wed Sep 11 00:00:00 EDT 2024 - Wed Sep 11 00:00:00 EDT 2024 | San Diego, California USA
San Diego Chapter In-Person Event: Reclaiming Precious Metal from SMT Scrap
Career Center | Costa Mesa, California USA | Engineering,Sales/Marketing,Technical Support
SALES- Growth opportunity to join a growing Manufacturers Rep firm. Looking for an aggressive sales professional to cover San Diego and the Mexican boarder areas of Tijuana, Tecate and Mexicali. Previous sales experience required selling to ele
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
Career Center | NORTHRIDGE, California USA | Engineering
EDUCATION BS Electronics and Communication Engineering Gujarat University MS Electrical Engineering California State University, Northridge ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE
SMTnet Express, November 6, 2014, Subscribers: 23500, Members: Companies: 14091, Users: 37109 Effect of Process Variations on Solder Joint Reliability for Nickel-based Surface Finishes Hugh Roberts, Sven Lamprecht, Gustavo Ramos, Christian Sebald
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PCB Libraries, Inc. | https://www.pcblibraries.com/forum/jstd001-plated-throughhole-obstruction_topic2145_post9247.html
J-STD-001: Plated Through-hole Obstruction - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register Login J-STD-001: Plated Through-hole Obstruction
