Electronics Forum | Tue Apr 26 03:28:26 EDT 2005 | Just mee
What test is applicable to check for QFN package with NiPdAu leadframe if leads/pad are solderable? what are the options other than dip and look solderability testing? Thanks,
Industry News | 2009-07-24 13:38:04.0
To address the thermal requirements posed by smaller outline, higher functioning power semiconductor devices, Henkel has formulated an advanced die attach solder paste suitable for both high-lead and lead-free applications.
Industry News | 2009-11-19 14:48:22.0
Broadening its well-known Multicore die attach solder portfolio, which already includes Multicore DA100 solder paste for high-lead and lead-free applications, Henkel today announced the launch of Multicore DA101. This newest formulation delivers many of the well-known benefits of Multicore DA100, but has been designed for screen print operations, thus offering flexibility for varying process requirements.
