Industry Directory | Manufacturer
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
Industry Directory | Manufacturer
Tropical Assemblies, Inc. is a 20 + year Electronic Contract Manufacturer of RF and Complex Printed Circuit Board Assemblies. Full turnkey operation from prototyping to full production box builds. AS9100/ISO Certified, ITAR reg.
The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
New Equipment | Rework & Repair Services
BGA Rework Service - Your BEST Source For High Quality BGA Rework Services BEST provides industry-leading solutions for BGA and other grid array device reworks. Our engineers have developed better processes to make BGA Rework Service more repeatable
Electronics Forum | Tue Mar 03 14:07:07 EST 2009 | macisaint
I'm having shorts appear on my QFN packages between pins, usually only after a week or so of power-on operation. The shorts are 1K and slowly down to hard shorts over time. Typically a defective part will have failures on multiple pins. I tried havi
Electronics Forum | Fri Mar 06 10:32:34 EST 2009 | fountain42
Yes, We've already experienced this same problem. 1) What kind of flux are you using? No Clean? Rosin? OA? 2) If it's OA, What kind of water wash do you do? Do you use DI water? How Hot? Who's machine? What are the pressures? 3) Have you performed a
Industry News | 2011-08-24 22:37:23.0
The SMTA announced that it will hold sessions and a tutorial on Package-on-Package (PoP) surface mount stacking at their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.
Industry News | 2013-04-02 17:20:44.0
The SMTA is pleased to announce the program for the 2013 International Conference on Soldering and Reliability being held May 14-17 in Toronto, Ontario, Canada.
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Parts & Supplies | Pick and Place/Feeders
For Panasonic SMT Spare Parts TAPE FEEDER CM402/602/NPM 12MM without sensor feeder KXFW1KSCA00 FA0020M0000 Product specification: Model For Panasonic 12MM without sensor Feeder P/N KXFW1KSCA00 FA0020M0000 Condition Full New In Stock Standar
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Parts & Supplies | Pick and Place/Feeders
For Panasonic SMT Spare Parts TAPE FEEDER CM402/602/NPM 44/56MM with sensor feeder KXFW1KS8A00 Product specification: Model For Panasonic 44/56MM with sensor feeder P/N : KXFW1KS8A00 Condition Full New In Stock Standard Yes Delivery
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2010-03-23 11:50:22.0
This document discuss how to design SMT stencil base on IPC-7525. Introduction: PCBA (Printed Circuit Board Assembly) is a segment of printed circuit board technology. This segment of printed circuit board industry is concentrated in assemble all the pieces of electronic industry to one piece before output them to market. This segment covers: interconnection technology, package design technology, system integration technology, board and system test technology
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su
Events Calendar | Wed Aug 16 00:00:00 EDT 2017 - Sat Aug 19 00:00:00 EDT 2017 | Harbin, China
ICEPT 2017, The 18th International Conference on Electronic Packaging Technology
Events Calendar | Mon Oct 09 00:00:00 EDT 2017 - Thu Oct 12 00:00:00 EDT 2017 | Raleigh, North Carolina USA
IMAPS 2017 - 50th International Symposium on Microelectronics
International Microelectronics Assembly and Packaging Society (IMAPS)
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express, December 16, 2021, Subscribers: 26,148, Companies: 11,476, Users: 26,983 Assembly and Rework of Lead Free Package on Package Technology Miniaturization continues to be a driving force in both integrated circuit
Assembly and Rework of Lead Free Package on Package Technology SMTnet Express March 15, 2012, Subscribers: 25003, Members: Companies: 8826, Users: 32832 Assembly and Rework of Lead Free Package on Package Technology by: Raymond G. Clark, Joseph D
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF9-Doc-Package-901-1-01.pdf
continues on following page. CF-9 User's Guide 22 GPD Global 09/30/92 Preventive Maintenance Schedule (continued) Interval Location Action Monthly Die Block Assembly Clean die block adjusting bolt (Figure 18, Item 1) with solvent and apply a small amount of
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1208&OB=ASC.html
SC-82AB Package - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register Login SC-82AB Package
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
