Industry Directory | Manufacturer
SCI Automation specializes in plasma cleaning, etching and surface activation equipment, and provides effective cleaning and etching solutions to the Semiconductor, Electronic, Automotive, Medical and Life Science industries.
Industry Directory | Manufacturer
We are specialize in High Quality SMT (Surface Mount Technology) spare parts and PCBA Process Equipments at very competitive price.
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New Equipment | Cleaning Equipment
All kinds of printing or adhesive substrate before the surface activation, modification, grafting, roughening or cleaning. Application: ．LCM, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED packaging, SMT, PCB, FPC, optoelectronic c
The PE-200 is our industrial strength bench top plasma etching system and supplied with an oxygen service vacuum pump. This robust, reliable and yet quite affordable system was developed for the busy 24/7 manufacturing firm that cannot have downtime.
Electronics Forum | Wed Jul 13 05:34:57 EDT 2005 | harryang
Any advice how to select plasma cleaner...Is Atmospheric plasma cleaning a better option than low pressure plasma (chamber) type? Thanks...
Electronics Forum | Tue May 26 12:53:49 EDT 2015 | edward_garcia
I am looking to clean about 50 plastic circuit boards per week with a plasma cleaning system. I am looking at these systems: http://www.plasmaetch.com/plasma-cleaning-systems.php Does anyone have a recommendation about size? I don't want to be fo
Used SMT Equipment | Semiconductor & Solar
Branson IPC 7102 710X/A v1.17 Plasma Cleaner appears to be in fair cosmetic condition with many signs of prior use or wear. There is NO TOP PANEL on this unit. The Power hook up needs maintenance, so no power check was done. https://www.ka
Industry News | 2017-11-29 14:28:56.0
Nordson MARCH announces its new-generation RollVIA™ plasma system, a completely self-contained vacuum plasma system with production-proven, roll-to-roll material handling for flexible printed circuit board (PCB) manufacturing. The new RollVIA incorporates unique vacuum and gas flow technology, new process control technology, updated electrode designs, and superior temperature management with precise control of roll speed, tension, and edge guidance for uniform plasma treatment of substrates as thin as 25 microns. The RollVIA system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during production of PCBs.
Industry News | 2018-05-31 10:23:37.0
Nordson MARCH announces that it has received the VISION Award from SMT China magazine and the Innovation Award from Electronics Manufacturing (EM) Asia magazine for its new-generation RollVIA™ plasma system. The awards were presented at NEPCON China, held in the Shanghai EXPO World Center, Shanghai, China, on April 24 and 25, 2018. The RollVIA™ plasma system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during printed circuit board (PCB) production. The RollVIA provides uniform plasma treatment of substrates as thin as 25 microns.
The BT-1 Plasma Etch System is fully automated and is capable of processing large quantities of parts up to 21"x21" for substrate cleaning and surface modification applications prior to bonding applications. VISIT THE PLASMA ETCH WEBSITE FOR MORE IN
Career Center | , | 2013-03-07 10:18:07.0
Currently work as Equipment Engineer at Integrated Microelectronics Inc., Philippines handles Line Maintenance Technicians, that performs production equipment setup and sustenance. Implements/creates improvements on assigned area. Maintains group KRA
SMTnet Express, June 1, 2017, Subscribers: 30,507, Companies: 10,601, Users: 23,315 Evaluating the Effects of Plasma Treatment prior to Conformal Coating on Eectronic Assemblies to Enhance Conformity of Coverage John D. Vanderford, Ann E. Paxton
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