Industry Directory | Manufacturer
Conformal Coating, Potting & Encapsulation Services. Parylene Deposition. ESS Testing, Plasma etchback & Desmear.
New Equipment | Surface Finish
VIA Series plasma treatment systems offer superior plasma treatment uniformity for printed circuit board (PCB) panels. The ModVIA is designed to process rigid and flexible PCB panels of various shapes and sizes for through-hole, blind via, etchback,
New Equipment | Cleaning Equipment
Industrial Plasma Cleaning System When plasma cleaning your product, whether it be small or large plastic parts, medical implants, wafers or electronic components, you will find that all are uniformly treated in the BT-1. Benefits to you are better
Electronics Forum | Tue Oct 18 14:24:25 EDT 2005 | Don Swenson - Honeywell
Are there any studies that document the benefits of positive etchback? Does positive etchback, particularly plasma, improve PWB reliability?
Electronics Forum | Wed Oct 19 07:44:33 EDT 2005 | davef
When a hole is drilled during board fabrication, it can transfer resin from the base material (eg, FR4 core or prepreg) to cover the exposed edge of conductive material in the wall of a drilled hole. This is called resin smear. Etchback is a control
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Industry News | 2017-05-10 18:15:53.0
Nordson ASYMTEK and Nordson MARCH, Nordson companies (NASDAQ: NDSN), will present papers at the Conformal Coating Materials and Processes session at the Contamination, Cleaning, and Coating Conference being held in Amsterdam, Netherlands. Transitioning from Manual to Automated Conformal Coating, by Michael Szuch, Nordson ASYMTEK and Optimizing the Plasma Treatment Process Prior to Conformal Coating to Eliminate ESD Induced Failures, by David Foote, Nordson MARCH, will be presented on Wednesday, May 24, 2017.
The BT-1 Plasma Etch System is fully automated and is capable of processing large quantities of parts up to 21"x21" for substrate cleaning and surface modification applications prior to bonding applications. VISIT THE PLASMA ETCH WEBSITE FOR MORE IN
Career Center | Shoubra Misr, Cairo, Egypt, Egypt | Engineering,Maintenance,Production,Quality Control
Refer to my CV
Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support
Duties & Responsibilities (Equipment Technician): Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment. Conduct Preventive maintenance
SMTnet Express, October 27, 2016, Subscribers: 26,530, Companies: 15,009, Users: 41,321 Press Fit Technology Roadmap and Control Parameters for a High Performance Process Jose Becerra, Dennis Willie and Murad Kurwa; Flex (Flextronics International
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined
| http://www.thebranfordgroup.com/dnn3/Auction/MULA0623.aspx
) Advanced Plasma Systems (APS) PWB-8-209 Etchback System w/ Spare Pump IS PUMEX-PUMIFLEX 2000 Series Scrubbing System Lantronic TT30 Lead-Free Hot Air Solder Leveler (HASL
