Industry Directory | Consultant / Service Provider / Manufacturer
QCG, Inc. - Your Printed Circuit Board Design and Assembly support in hard to build technology such as Package on Package (PoP BGA), Dual row QFN / Multi row QFN and fine pitch bump die; all with competitive rates.
Industry Directory | Manufacturer
SP is a high mix low to medium volume PCB + PCBA shop located in Taiwan. We are in business since 2001 with over 1,000 active customers and certified to ISO-9001, ISO-14001 standards.
The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
New Equipment | Rework & Repair Services
Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA
Electronics Forum | Tue Apr 15 18:49:37 EDT 2014 | hegemon
Evtimov, Are you talking about placing an already built POP package, or about building the POP package at the SMT line? 'hege
Electronics Forum | Thu Jun 28 15:22:59 EDT 2012 | spitkis2
Would like to ask end users or those with experience using infra red rework equipment (specifically when the top heater is IR) the following: 1. Can you successfully rework Package On Package (PoP) type devices? With heat directed through the packa
Industry News | 2012-07-12 10:34:27.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Industry News | 2012-07-12 10:34:54.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
.jpg)
Parts & Supplies | Pick and Place/Feeders
For Panasonic SMT Spare Parts TAPE FEEDER CM402/602/NPM 12MM without sensor feeder KXFW1KSCA00 FA0020M0000 Product specification: Model For Panasonic 12MM without sensor Feeder P/N KXFW1KSCA00 FA0020M0000 Condition Full New In Stock Standar
.jpg)
Parts & Supplies | Pick and Place/Feeders
For Panasonic SMT Spare Parts TAPE FEEDER CM402/602/NPM 24/32MM with sensor feeder KXFW1KS7A00 N610004577AA Product specification: Model For Panasonic 24/32MM with sensor feeder P/N: KXFW1KS7A00 N610004577AA Condition Full New In Stock St
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2021-12-16 01:48:41.0
Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging.
With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su
Panasonic AM100 SMT Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express, December 16, 2021, Subscribers: 26,148, Companies: 11,476, Users: 26,983 Assembly and Rework of Lead Free Package on Package Technology Miniaturization continues to be a driving force in both integrated circuit
SMTnet Express, December 13, 2018, Subscribers: 31,514, Companies: 10,659, Users: 25,503 Assembly Reliability of TSOP/DFN PoP Stack Package Credits: Jet Propulsion Laboratory Numerous 3D stack packaging technologies have been implemented
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/n610095857ab-n610095856aa-cm-npm-pop-feeder-147465?page=243&order=name+asc
PANASONIC CM / NPM POP feeder N610095857AB/N610095856AA | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products CM / NPM POP feeder Public Pricelist Public Pricelist CM
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4717
: Sandia National Laboratories Date Published : 9/25/2016 Conference : SMTA International Abstract: Package-on-package (PoP) and package-on-package-onpackage (PoPoP
