Industry News | 2010-06-23 11:36:12.0
Siplace presented a solution to NOTE satisfying their wide ranging needs
Industry News | 2014-05-13 17:01:55.0
Indium Corporation's Graham Wilson, applications engineer, will present at Brasage in Brest, France on Friday, May 23. Wilson's presentation, Elimination of Head-in-Pillow in PoP Assembly: A Flux Approach, discusses eliminating head-in-pillow defects in the package-on-package (PoP) assembly process by engineering unique attributes of the flux chemistries of dipping fluxes and pastes.
Assembly and Rework of Lead Free Package on Package Technology SMTnet Express March 15, 2012, Subscribers: 25003, Members: Companies: 8826, Users: 32832 Assembly and Rework of Lead Free Package on Package Technology by: Raymond G. Clark, Joseph D
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1109&OB=DESC.html
: In the upcoming V2013.14 release Extended Footprint Names will be the new default STEP – Now supported for all component families including the new SOL package STEP
| https://www.smtfactory.com/Development-Stage-of-SMT-Pick-and-Place-Machine-id47535177.html
production capacity per unit area is 1~2 times higher than that of the second generation machine. ● Possibility of stacking (PoP) assembly ● Intelligent software systems, eg, efficient programming and traceability systems. SMT Pick and Place Machine SMD Line
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
