Industry Directory | Manufacturer
Sikama International designs, develops, manufactures and markets reflow solder furnaces/curing systems, featuring our patented conduction+convection heating and cooling technology. Our furnaces are designed for efficient use of power and gas.
New Equipment | Test Equipment
KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t
New Equipment | Soldering - Other
Whether batch or inline, atmospheric or vacuum, the SolderStar solution for Vapor Phase machines allows engineers to understand and control their production vapour phases processes. Vapour phase soldering is not a new process, and with advanced machi
Electronics Forum | Thu Apr 11 20:35:22 EDT 2002 | davef
Messy. Messy. Messy. Consider gluing these components, until you control your process. It is unclear to us that a single factor drives these defects, but multiple factors that need to be tuned to work well together. PAD DIMENSIONS * Some SM-782 pa
Electronics Forum | Thu Apr 11 16:37:16 EDT 2002 | pteerink
Profile would be the first place I look. Check your rise and fall rates for temp. Should be no more than 2 deg/sec for rise and 4-6 deg/sec for cooling. Phil
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
ETA DIP Inverted Camera Online AOI Machine ETA-V5200 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI m
DIP Double-side Camera Online AOI Machine ETA-V5300 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI mac
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Project Management, SMT Process Engineering
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SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf
. Hence, when typical four- to five-minute profiles can be completed in three to four minutes, throughput increases of 20 to 25 percent are likely
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-frequently-asked-questions
? Four effects are more significant than others. Increased surface tension of molten solder alloy changes fillet shapes, improves part centering, and may increase tombstoning
