Advanced semiconductor packaging and high precision SMT assembly convergence. Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced techno
Electronics Forum | Fri Feb 16 09:30:38 EST 2007 | DEK Answer Guy
Hello PR, PumpPrint� technologies enable high throughput adhesive deposition using a screen printing platform. Careful selection of stencil material, and informed study of the design of apertures and other stencil features, enables a wide range of
Electronics Forum | Mon Feb 12 21:38:38 EST 2007 | DEK Answer Guy (PR Dept)
Technical Papers) -ProFlow� upgrades (MPU's). -Paste Low Optimisation -Adjustment of the Print Carriage to ensure Squareness to the Stencil -Replacement of Hinge Pin Assembly -Conversion of ProFlow� to Horizontal Mount -ProFlow� Guides for Operators
Industry News | 2006-04-17 18:17:31.0
DEK has won another prestigious industry award for its revolutionary ProFlow� DirEKt Imaging technology. At the Nepcon China 2006 exhibition in Shanghai, China, DEK will receive the award for best entry in the Dispensing Systems/Equipment category at the Electronics Manufacturing Asia Innovation Awards 2006.
Industry News | 2003-05-21 08:51:07.0
DEK has added a new section to its website that consolidates information on the benefits of using PumpPrint process technology for high-speed adhesive deposition.
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