Industry Directory: push test acceptance criteria (3)

MARVEL INDUSTRY LIMITED

Industry Directory | Consultant / Service Provider / Manufacturer / Manufacturer's Representative

Experienced PCB circuit board and laser SMT stencil maker. Focus on complex PCB making up to 30 layers. Please visit www.marvelpcb.com for more details

Circuit Board Ready

Industry Directory | Consultant / Service Provider / Manufacturer

Prototype complex PCB expert in Hong Kong China. Short lead time, professional of small volume, sampling making. Visit as https://www.marvelpcb.com for details

New SMT Equipment: push test acceptance criteria (2)

IPC-A-600 Instructor (CIT)  - Training and Certification

IPC-A-600 Instructor (CIT) - Training and Certification

New Equipment | Education/Training

Bare Board Inspection Training This 3-day, lectured course utilizes the images in the IPC-A-600 document to provide visual accept/reject criteria examples for all three classes of bare board fabrication and inspection. The IPC-A-600, “The Acce

EPTAC Corporation

Bob Willis Electronics Assembly Video Library

Bob Willis Electronics Assembly Video Library

New Equipment | Education/Training

Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for

ASKbobwillis.com

Electronics Forum: push test acceptance criteria (76)

SMD acceptable criteria

Electronics Forum | Fri Dec 09 06:25:53 EST 2005 | ajay

thanks for info Most of the defect soldering joint do not take place. Observe that PCB not cleaned properly & also component wetting not good. testing staff expect that all card what ever they receiev shuld be 100% ok. they straight forward complain

CCGA solderability criteria

Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika

Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp

Used SMT Equipment: push test acceptance criteria (5)

Aqueous Technologies SMT-800-LD Batch Wash

Aqueous Technologies SMT-800-LD Batch Wash

Used SMT Equipment | Board Cleaners

Automatic Wash + Rinse + Cleanliness Test + Dry + SPC Lead Free Ready The SMT Series Cleaning Systems include the industry's most powerful batch-format drying system.  The SMT series cleaners utilize a combination of convection and radiant heat t

Capital Equipment Exchange

Mydata MY19 SMT Placement

Mydata MY19 SMT Placement

Used SMT Equipment | Pick and Place/Feeders

HUGE 36" x 28" pcb capability. Fast, flexible, and capable. The standard in ease of use. Configuration: ML6 (big board) Y-wagon Tray wagon magazine Tpsys version 2.9.13e Active options Electrical two-pole test & Electrical tran

Capital Equipment Exchange

Industry News: push test acceptance criteria (69)

Five IPC APEX EXPO Exhibiting Companies Earn 2019 Innovation Awards Winners push boundaries of technology with innovative product submissions

Industry News | 2019-01-12 07:42:28.0

IPC – Association Connecting Electronics Industries® announces the winners of the IPC APEX EXPO 2019 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.

Association Connecting Electronics Industries (IPC)

Technical Library: push test acceptance criteria (2)

Using Rheology Measurement As A Potentially Predictive Tool For Solder Paste Transfer Efficiency And Print Volume Consistency

Technical Library | 2020-07-02 13:29:37.0

Industry standards such as J-STD-005 and JIS Z 3284-1994 call for the use of viscosity measurement(s) as a quality assurance test method for solder paste. Almost all solder paste produced and sold use a viscosity range at a single shear rate as part of the pass-fail criteria for shipment and customer acceptance respectively. As had been reported many times, an estimated 80% of the defects associated with the surface mount technology process involve defects created during the printing process. Viscosity at a single shear rate could predict a fatal flaw in the printability of a solder paste sample. However, false positive single shear rate viscosity readings are not unknown.

Alpha Assembly Solutions

The Risk And Solution For No-Clean Flux Not Fully Dried Under Component Terminations the Risk And Solution For No-Clean Flux Not Fully Dried Under Component Terminations

Technical Library | 2020-11-24 23:01:04.0

The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.

Indium Corporation

Videos: push test acceptance criteria (82)

This video describes the IPC A-600 training and certification program.

This video describes the IPC A-600 training and certification program.

Videos

This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo

BEST Inc.

This video describes the IPC A-600 training and certification program.

This video describes the IPC A-600 training and certification program.

Videos

This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo

BEST Inc.

Training Courses: push test acceptance criteria (220)

IPC-6012 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-6012 Specialist (CIS)

The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.

Blackfox Training Institute, LLC

IPC J-STD-001 Trainer (CIT) Recertification Course

Training Courses | | | IPC J-STD-001 Trainer (CIT) Recert.

The Certified IPC J-STD-001 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC J-STD-001 (CIS) training.

Blackfox Training Institute, LLC

Career Center - Jobs: push test acceptance criteria (1)

SMT Process Engineer

Career Center | Huntington Beach, California USA | Engineering

Trantronics, Inc. A well-established electronics assembly company who specializes in outstanding customer services and on time delivery is seeking a motivated hardworking individual to john our team at the Hunting Beach location. Responsibilities

TRANTRONICS, INC.

Career Center - Resumes: push test acceptance criteria (1)

Electronic And Telecom

Career Center | Damascus, Syria | Engineering,Maintenance,Production,Technical Support

Experience : 1- PCB Test Engineer For Telecom Products And TV - LCD Manufacturing as follow : - In-Circuit and Automatic Test Equipment Test - in-circtuit Emulator - Function Test - Automatic Optical Inspection Test - Toubleshooting Axial

Express Newsletter: push test acceptance criteria (883)

Sustaining a Robust Fine Feature Printing Process

Sustaining a Robust Fine Feature Printing Process Sustaining a Robust Fine Feature Printing Process With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component packaging is pushing surface mount technology

Development of Ultra-Multilayer Printed Circuit Board

the market demand for a "semiconductor test board

Partner Websites: push test acceptance criteria (162)

IPC-A-600 Specialist Course | Online, In-Person & Challenge Test

| https://www.eptac.com/class/ipc-a-600-specialist

Definitions Acceptance Criteria Externally Observable Characteristics Board Edges Base Material Surface and Subsurface Solder Coatings and Fused Tin Lead Holes

SMT Magazine, September 2016

Blackfox Training Institute, LLC | https://www.blackfox.com/wp-content/uploads/2017/04/BlackFox_Sharon.pdf

• General soldered connection acceptance requirements (including lead free) • Machine and reflow soldering process requirements • Test methods and related standards

Blackfox Training Institute, LLC


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