New Equipment | Education/Training
All Bob Willis training workshops are run on site at your manufacturing facility, conference or exhibition venues Worldwide. We offer the largest range of theory and hands on workshops in the industry. The content of any workshop may be modified to s
Electronics Forum | Thu Mar 06 13:12:55 EST 2008 | shrek
KRIKIES Chunks me-lady. Yellow toe-nails with tree rosin will definitely sodder that there immersion silver. Sounds like i have met me match. Who is this fella with the toe-nails?
Electronics Forum | Thu Mar 06 12:37:05 EST 2008 | realchunks
Long, yellow, ugly toe nails will have the same affect on your boards.
Industry News | 2016-07-10 12:08:40.0
All our training workshops are run on site at your manufacturing facility, conference or exhibition venues worldwide. We offer the largest range of topics in the industry
Industry News | 2019-08-14 12:58:24.0
Here are our up and coming online webinars, the second best in the business world wide, Cleaning, Failure Analysis, Low Temperature Soldering and QFNs. Have all of your questions answered during one of our monthly sessions http://www.bobwillis.co.uk/events
Technical Library | 2018-05-23 12:12:43.0
Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop.
Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_son-qfn-calculations_topic889.xml
:31pmThis might also help to clarify . . . SON / QFN Calculations : Our experience has been that vendor... Author: jnelso09Subject: 889Posted: 15 Mar 2013 at 12:47pmOur experience has been that vendor recommended footprints for QFN devices either don't exist or they are contrary to applications
| https://www.eptac.com/webinars/tempered-leads-class-3-rework-toe-fillets-and-more/
. Definition of Class III Rework. Dissecting Toe Fillets on Gull Wing components. Understanding Gold Plating vs. Gold Flash. Have a question about training or IPC certification
