Electronics Forum | Thu Apr 15 11:15:30 EDT 2004 | patrickbruneel
Pure (red) copper oxide is green, its not a residue its just oxidation. In your case water and heat will accelerate the oxidation process of unplated or unprotected pure copper. The best way to avoid this from happening is use a socket with tin or n
Electronics Forum | Mon Aug 13 08:04:43 EDT 2007 | davef
Search the fine SMTnet Archives [on gold finger], while you're waiting for others to reply. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=42759
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2015-03-20 05:30:21.0
A Full Range of DDR4 UDIMM and SO-DIMM Modules Available for the Next Generation of Embedded
Technical Library | 2018-05-09 22:15:29.0
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCB. The iNEMI technical subcommittee on creep corrosion has developed a flowers-of-sulfur (FOS) based test that is sufficiently well developed for consideration as an industry standard qualification test for creep corrosion. This paper will address the important question of how relative humidity affects creep corrosion. A creep corrosion tendency that is inversely proportional to relative humidity may allow data center administrators to eliminate creep corrosion simply by controlling the relative humidity in the data center,thus, avoiding the high cost of gas-phase filtration of gaseous contamination. The creep corrosion relative humidity dependence will be studied using a modified version of the iNEMI FOS test chamber. The design modification allows the achievement of relative humidity as low as 15% in the presence of the chlorine-releasing bleach aqueous solution. The paper will report on the dependence of creep corrosion on humidity in the 15 to 80% relative humidity range by testing ENIG (gold on electroless nickel), ImAg (immersion silver) and OSP (organic surface preservative) finished PCBs, soldered with organic acid flux.
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/korean-black-ginseng-extract-royal-gold-960g-240g-bottle
. Manufacturer : Ire Red ginseng Corporation Production : Made in Korea Share 0 Share on Facebook Tweet Tweet on Twitter Pin it 0 Pin on Pinterest Fancy Add to Fancy +1
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
Surface Finish on Assembly Quality and Attachment Reliability of a Plastic Ball Grid Array,” “The Effect of Modifications to the Nickel/Gold Surface Finish on Assembly Quality and Attachment Reliability of a Plastic Ball Grid Array,” IEEE Transactions on
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