Industry Directory | Manufacturer
Design and manufacture of assembly fixtures
Industry Directory | Manufacturer
Designers and Builders of PCB process PALLET solutions. Selective solder pallets. Surface Mount process carriers. Conformal Coating masking and spray clear pallets. Masking pallets for wave solder. Wash Trays with PCB securing
Description Ricocel is made by fiber glass cloth and high temperature resin. It is an ideal material for solder pallets, wave solder pallets, SMT solder pallets, SMT solder fixtures, selective solder fixtures and other specialty soldering fixtures.
explorFlow - SMT reflow system,Made by Vanstron Automation A high-quality reflow oven for medium/large production in the SMT industry. Fully prepared for the lead-free soldering process, this oven attains excellent thermal uniformity. Main Featu
Electronics Forum | Fri Aug 27 10:25:52 EDT 1999 | Matthew Park
Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective wav
Electronics Forum | Mon Nov 27 20:44:01 EST 2017 | cmchoue
Dear expert's, I want to find the carrier that can support SMT print,placement,reflow and size can adjust. (My production is Motherboard) Does anyone have experience on it?or any infromation or photo can reference? Thanks Best w
Used SMT Equipment | AOI / Automated Optical Inspection
OMRON AOI VT-S720-A MACHINE Hardware Configuration Image signal input unit Main unit Power supply Air Camera Illumination Image resolution Feed method Line height PCB carrier width adjustment Ambient operating temperature Ambient opera
Used SMT Equipment | Soldering - Reflow
Specifications* Model Pyramax 150N Temperature Ratings: Process Chamber 350°C Vacuum Chamber 300°C Convection Heated Zones 10 top and bottom Vacuum chamber Heat Assist 2 heated convection zones Vacuum Chamber Zones 1 Zone Vacuum
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Technical Library | 2013-02-08 22:56:47.0
Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the total void content is minimal. X-ray methods are the predominate method for solder void analysis but this method can be quite subjective for non grid array components due to the two dimensional aspects of X-ray images and software limitations. A novel method of making a copper "sandwich" to simulate under lead and under component environs during reflow has been developed and is discussed in detail. This method has enabled quantitative solder paste void analysis for lead free and specialty paste development and process refinement. Profile and paste storage effects on voiding are discussed. Additionally an optimal design and material selection from a solder void standpoint for a heat spreader on a BCC (Bumpered Chip Carrier) has been developed and is discussed.
UVLED is widely used in all walks of life is reasonable, UVLED has a great advantage over UV curing, its emergence is very necessary. Firstly, the service life of the UV curing system is longer than that of the traditional UV curing system of 800-30
This unique full process carrier can run thru screen printing, pick & place, reflow soldering, vision inspection and X-ray inspection. The PCB can be set to the center on the y axis and flush too slightly above the top surface of the carrier for scr
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization
Career Center | palakkad, India | Technical Support
I had 4 years experience 3 years in SMT Field and 1 year in Stock Market I have well experience in SMT process and machine Knowledge personally I have well knowledge on reflow, SPI,DEK AOI I can handle the process related issues and tackle the situa
Career Center | Sullivan, Ohio USA | Engineering,Maintenance,Production,Quality Control,Sales/Marketing,Technical Support
PROFESSIONAL EXPERIENCE Manufacturing Engineer August 1991 - January 2014 * Read blueprints, wiring diagrams, schematic drawings, or engineering instructions for assembling electronics units, applying knowledge of electronic theory and component
SMTnet Express, December 16, 2017, Subscribers: 31,015, Companies: 10,789, Users: 24,054 Controlling Voiding Mechanisms in the Reflow Soldering Process Keith Sweatman, Takatoshi Nishimura, Kenichiro Sugimoto, Akira Kita; Nihon Superior Co., Ltd
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
(pastes in some cases) to assist solder reflow. In addition to acting as a carrier gas for formic acid vapor, the nitrogen atmosphere significantly reduces the presence of atmospheric oxygen within the oven that could lead to reoxidation of metal
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/3491.html
: WPC-tray carrier WPC-tray carrier PREVIOUS： 03047325-01 NEXT： 03047364S01 RELATED PRODUCTS CATEGORIES ABOUT US + SURFACE MOUNT SYSTEM + REFLOW FURNACE + OTHER PARTS + CONTACT US + CONTACT US Tel
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