Electronics Forum | Tue Aug 10 09:17:50 EDT 2004 | davef
The thermal recipe you use is dependant primarily on the solder paste that you choose.
Electronics Forum | Tue Aug 24 11:44:50 EDT 2004 | Dreamsniper
The best is, create 2 different profiles for each PCB type. Then segregate or separate them and do not let them run together in one line. Switch to the proper profile settings each time you change to other PCB type. This is the best. Each PCB materia
Used SMT Equipment | Soldering - Reflow
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Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Industry News | 2013-02-27 15:04:56.0
February 2013 ― OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth E22 at the Enova Grand Ouest exhibition, scheduled to take place March 27-28, 2013 in Rennes, France.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2000-06-27 10:27:05.0
This paper shall discuss the appropriate guidelines and troubleshooting methods for reflow profiling, and in particular shall focus upon the benefits of implementing the linear ramp-to-spike profile.
The LPKF ProtoFlow S reflow oven, with lead free capability, has significant advantages over previous models and rich features including a PC control software package. Learn more: http://www.lpkf.com/products/rapid-pcb-prototyping/smd-assembly/solder
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SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 97, (#ts#)) SMT Express, Volume 4, Issue No. 1 - from SMTnet.com Volume 4, Issue No. 1 Thursday, January 17, 2002 Featured
Heller Industries Inc. | https://hellerindustries.com/heller/vacuum-profile-reflow/
. Vacuum reflow profile setup with Heller’s user interface. Example of solder splash. Heller Blog Tips on Creating an Effective Formic Acid Reflow Process Tips for Setting Up an Optimized Vacuum Profile when Using Vacuum Assisted Reflow help
| http://etasmt.com/cc?ID=te_news_industry,24565&url=_print
. So, you must analyze your target board first before creating a unique reflow profile. Make an virtual reflow profile. A virtual reflow profile is based upon soldering theory, the recommended solder profile from the solder paste manufacturer, size, thickness, cooper weight, layers of the board and size, and the
