New Equipment | Selective Soldering
For flexible miniwave soldering processes and dip soldering processes that guarantee short cycle times. The high-end system which leaves nothing to be desired. Maximum Power for Your Selective Production. SEHO PowerSelective is featured with an ou
Electronics Forum | Thu Dec 14 04:42:11 EST 2017 | jineshjpr
Can anybody suggest how can I achieve good solderability in convectional reflow oven If I reduced Convection Air Speed 80%. The whole purpose is to reduce 0402 LED tilting in the convectional reflow and the PCB having QFN with 60 to 120 sec soak, 30
Electronics Forum | Thu Dec 14 05:07:55 EST 2017 | tsvetan
picture of the problem would help people to speculate what you do wrong
Industry News | 2021-10-11 16:13:11.0
MIRTEC will showcase its cutting-edge INTELLI-PRO AI Based Smart Factory Automation Solution and GENSYS-PIN Automotive Pin Inspection System in booth #461, Hall A2 at the 2021 Productronica exhibition. The world's largest exhibition for the electronic manufacturing industry will take place on Nov. 16-19, 2021, at Messe Munich exhibition hall in Germany.
Industry News | 2016-02-25 08:45:46.0
Akrometrix today announced that it has developed an automated die-board (or daughter-mother board) attach tilt metrology. All Akrometrix shadow moiré or DFP systems (AXPs) can be upgraded with the new feature.
Technical Library | 2018-09-26 20:33:26.0
Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
Wave Soldering Tilt Conveyor If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCB conveyor, PCB magazine loader, PCBA coating conveyor, pcb
Wave Soldering Tilt Conveyor If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCB conveyor, PCB magazine loader, PCBA coating conveyor, pcb
Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder
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X-ray3000 Equipment_Shenzhen Honreal Technology CO.,Ltd. HOME ABOUT Company Profile Work shop Honors Package Our Client PRODUCTS Pick and Place Machine SMT nozzle and feeder SMT Reflow Oven Line Dip wave soldering line PCB handling equipment SMT Cutting