Industry Directory | Manufacturer / Other
We are Japanese based solder manufacturer under Nihon Genma Mfg Co Ltd. Our company located in Malaysia and we distribute solder products worldwide. We are looking for aggresive business partner around the world. Contact us!!
Industry Directory | Manufacturer
Manufacturer of Vacuum Soldering Systems, Vacuum Reflow Ovens, Sintering Systems, Solder Paste Drying Systems, and Sintering Paste Drying Systems
New Equipment | Solder Paste Stencils
Full automation solder paste screen stencil printers for led tube light PCB solutions CL-1200,1500 Ideal for LED strip production. CL1200 provides fast, high-precision printing LED panels and other applications. Fully automatic production transpo
New Equipment | Solder Materials
Responsible Recycling Services for Solder Waste. Alpha provides electronics assemblers safe, efficient solder recycling services which will help them meet environmental and legislative requirements while maximizing the return on their solder dross,
Electronics Forum | Fri Jul 29 10:03:02 EDT 2011 | blnorman
At a previous location we used the Semco cartridges. Occasionally the operator would have to scrape down the stencil and knead the paste back in. That would keep the paste on the edges from drying out. It was just standard procedure.
Electronics Forum | Thu Dec 10 12:53:12 EST 2009 | deanm
Bryan, Dyoungquist is correct. You should not need to mix solder paste. Overmixing solder paste can adversely affect it. Follow these guidelines and you should be fine: 1. Keep unopened containers of paste in the refrigerator. 2. Take one container
Used SMT Equipment | Screen Printers
DEK Horizon 03iX Fully Automatic Screen Solder Paste Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling&n
Used SMT Equipment | Screen Printers
DEK 03IX automatic solder paste printing machine features advanced up/down k-view vision system, independent control and adjustment of lighting, high-speed moving lens, accurate alignment of PCB PCB and net board. The DEK Horizon 03IX automatic solde
Industry News | 2003-04-01 08:40:24.0
Using environmentally safe solvents these machines offer two-stage, multiple-frequency ultrasonic cleaning, rinsing and drying for pcb defluxing, cleaning of precision parts and metal degreasing.
Industry News | 2021-11-08 09:27:12.0
Baja Bid will be liquidating excess and unused assets via online auction. The bidding for this event will open promptly at 8:00am EST on November 11th and the closing will begin at 1:00 pm EST on November 17th.
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
Technical Library | 2022-12-23 20:44:54.0
One of the upcoming reliability issues which is related to the lead-free solder introduction, are the headin-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moiré profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 µm have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Career Center | Lalkua, India | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support
Machine maintenance Service and support knowledge with customer satisfactory. Deal with customers at all level via phone,remote and mail.Sound knowledge of PCB fabrication machine.
Career Center | Danao city, Cebu Philippines | Engineering,Maintenance,Production,Quality Control
JUKI Chip Mounter Maintenance and Troubleshooting JUKI Chip Mounter programming MINAMI Solder Paste Printer Maintenance and Troubleshooting MINAMI Solder Paste Printer programming PWB Loader / Unloader Maintenance and Troubleshooting TAMURA Reflow ma
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smeared solder paste pattern. A typical pad size for
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. Ensure that printed circuit boards are dried properly before the application of solder, or make changes to control humidity in the manufacturing environment. Solder Paste
ASCEN Technology | https://www.ascen.ltd/optical_inspection/1073.html
manual list PCB Depaneling Operate Manual Face mask making machine Mask making machine manual PCB magazine loader PCB conveyor PCB magazine unloader Axial component lead former PCB solder paste printer
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