Industry Directory | Consultant / Service Provider
Engelmaier Associates, L.C. provides Design-for-Reliability, failure root cause analysis, workshops, litigation support for PCBs and electronic assemblies.
Industry Directory | Consultant / Service Provider
Root Cause training, consulting, publishing, conferencing: Helping you learn from things that go wrong, without hurting people in the process. We'll CHANGE the way you think about FAILURE and its CAUSES! According to our customers, we offer the most PRACTICAL, DECISVE, LIFE-CHANGING approach on the market.
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
Determine why product fails in the field by reviewing process checkpoints
Electronics Forum | Mon Jul 30 20:38:02 EDT 2012 | davef
I'm with you on microcracking. The best way to confirm this is through sectioning of the affected capacitors. You're fortunate to be seeing these failures showing-up early in your product life. Of times these failures don't appear for years.
Electronics Forum | Wed Aug 22 12:44:26 EDT 2012 | rway
I would look at your de-paneling process. How are you cutting the boards? This could be inducing mechanical stress on the component; especially if the part is close to the edge of the pcb and perpendicular to it.
Used SMT Equipment | AOI / Automated Optical Inspection
This machine was rejected for shipping damage in transit to the OEM from factory. See shipping damage in photos on our website. CEE will demonstrate in full for your acceptance! Dual Lane (Can handle a 510 x 580mm PCB while running in single lan
Used SMT Equipment | In-Circuit Testers
Agilent 16903A Logic Analysis System The Agilent 16903A logic analysis system provides high-performance, system-level debugging of digital designs. Expandability is the key to the system´s long-term value. Customize this system for your specifi
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2010-02-18 21:26:02.0
Minneapolis, MN - The SMTA is pleased to announce several new webinars coming up in March. Webinars are 60 to 90 minute online presentations comparable to a conference session. In response to industry-wide budget cuts and travel restrictions, SMTA has committed to increasing its online programming to better accommodate member needs for technical exchange.
Technical Library | 2021-09-15 18:53:20.0
Many printed circuit board assemblies (PCBAs) have relays that are soldered to the PCB. If such an electromechanical component fails, it can cause the whole device to fail, just like any other electronic component. The spectrum of root causes that lead to an increased contact resistance or a complete contact failure is totally different from what usually occurs in the electronics domain. This article provides a detailed analysis of these failures and the corresponding root causes, many of them self-centering.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Bob Willis "How to Do It" video clip explains how to test BGA or Area Array Packages for solderability. The reason this is difficult to do by other means is the solder terminations would be displaced during solder contact. A simple test like this als
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Mon Apr 06 00:00:00 EDT 2020 - Mon Apr 06 00:00:00 EDT 2020 | ,
Reflow Simulation – X-ray & Optical Help Solves Design & Process
Events Calendar | Thu Jun 08 00:00:00 EDT 2023 - Thu Jun 08 00:00:00 EDT 2023 | ,
SMTA Workforce Development Webinar: PCB Design Courses and Careers in PCB Design
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Charlotte, North Carolina USA | Engineering
Coordinates activities and provides support to QA, operations and the materials group to establish programs for monitoring and managing supplier quality. Reviews and dispositions discrepant materials, initiates corrective actions and coordinates fai
Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control
• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat
Career Center | Tucson, Texas, Florida, Georgia, Alabama USA | Technical Support
Experienced Field Service Engineer. New installations, emergency calls, preventative maintenence and customer training experience. Territory management and parts inventories.
SMTnet Express, July 19, 2018, Subscribers: 31,194, Companies: 10,991, Users: 24,953 Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Greg Smith; FCT ASSEMBLY, INC. Reduction of first pass defects in the SMT assembly process
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-services/training-services/on-site/
” to comply with ISO requirements Systematic focus on root cause determination and defect elimination Establishment of key performance indicators for your training program Analysis and reporting of
| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print
. Dewetting directly impacts the quality of solder joints. Root Cause Analysis The PCB pads or the component‘s pins are oxidized. An oxidation layer prevents contact between the solder and the surface plating layer
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