New Equipment | Cable & Wire Harness Equipment
Overview The ESU 6 ElectrolyteStaining Unit is a component of the MicroGraph System for the creation of high quality cross-sectional images of crimp connections and others. Very simple handling Efficient and quick cleaning Cleaning dir
New Equipment | Cable & Wire Harness Equipment
Overview The SawPolish Unit is a component of the MicroGraph System for the creation of high quality cross-sectional images of crimp connections. Three models for sawing and polishing a wide range of crimp connections Polishing disc is in line w
Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef
Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u
Electronics Forum | Tue Oct 30 17:16:24 EST 2001 | seand
Hello Chris, If you could humor me, what are the limiting factors forcing your dot size to .010"? What is the die size that you are placing? What are the accuracy tolerances? Was eutectic die attach never an option for this bare die? Have you de
Used SMT Equipment | X-Ray Inspection
• Nordson DAGE VR950 new technology, open, transmissive X-ray tube: -All voltages can reach <0.95 micron feature resolution – The highest voltage is 160KV, target power: 3W -Long service life of filament components -Automatic st
Used SMT Equipment | X-Ray Inspection
This is a factpry refurbished unit in February 2014, offered with 90 dyas parts and 30 days labor warranty The NXR-1400i x-ray inspection system for production quality assurance, failure analysis and rework verification. System includ
Industry News | 2003-03-12 08:28:44.0
CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.
Industry News | 2011-10-28 00:33:44.0
After economic setbacks in 2009, the world market for electronics manufacturing services (EMS) returned to growth in 2010, according to a study released by IPC.
Technical Library | 2010-08-05 18:39:39.0
Variability analysis is important in successfully deploying multi-gigabit backplane printed wiring boards (PWBs) with growing numbers of high-speed SerDes links. We discuss the need for large sample sizes to obtain accurate variability estimates of SI me
Technical Library | 2024-06-23 21:57:16.0
Two extremes of reflow time scale for copper pillar flip chip solder joints were explored in this study. Sn-2.5Ag solder capped pillars were joined to laminate substrates using either conventional forced convection reflow or the controlled impingement of a defocused infrared laser. The laser reflow joining process was accomplished with an order of magnitude reduction in time above liquidus and a similar increase in solidification cooling rate. The brief reflow time and rapid cooling of a laser impingement reflow necessarily affects all time and temperature dependent phenomena characteristic of reflowed molten solder. These include second phase precipitate dissolution, base metal (copper) dissolution, and the extent of surface wetting. This study examines the reflow dependent microstructural aspects of flip chip Sn-Ag joints on samples of two different size scales, the first with copper pillars of 70μm diameter on 120μm pitch and the second with 23μm diameter pillars on a 40μm pitch. The length scale of Pb-free solder joints is known to affect the Sn grain solidification structure; Sn grain morphology will be noted across both reflow time and joint length scales. Sn grain morphology was further found to be dependent on the extent of surface wetting when such wetting circumvented the copper diffusion barrier layer. Microstructural analysis also will include a comparison of intermetallic structures formed; including the size and number density of second phase Ag3Sn precipitates in the joint and the morphology and thickness of the interfacial intermetallics formed on the pillar and substrate surfaces.
BESTEMP reflow checker 6 channel temperature profiler Reflow soldering temperature tester Characteristic: 1..High efficiency, data can be stored up to 16 times continuously, and can be downloard to computer for group data viewing. 2. Modular analys
In this video we show you how to perform an automated x-ray inspection using the TruView Prime
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Career Center | San Jose, Nationwide | Engineering,Management
This world-renowned $13B organization is seeking a Product Reliability Engineering Manager (to report directly into the VP) for our San Jose, CA corporate technology office. We prefer candidates in the Silicon Valley area, but will consider candidat
Featured Article Previous Page Analysis of Factors tha
Surface Insulation Resistance Testing. Results of Independent Testing for Best Inc. BGA Stencil Repair Rework Samples Solder Paste Reattachment If you don't see the images, please visit online version at #Application
Baja Bid | https://bajabid.com/wp-content/uploads/2023/06/XT-V-130-flyer-EN.pdf
. With the XT V 130, you can get the inside view of printed circuit boards, in a smooth, non-destructive process. The Nikon Metrology XT V130 X-ray inspection system is a high-precision, flexible solution that facilitates defect analysis in loaded PCB boards. Designed for 100% BGA and
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
, 1292 data (6 components x 3 boards x 4 components sizes x 18 reflow profiles) were collected. Note that the sample size for each component type and reflow profile is 18 (6 components per board x 3 boards). The peak shear force and failure modes were
