Industry Directory | Manufacturer
Nitrogen Hot Air Circulation Reflow, Screen Printer, Wave Soldering, Double Unloader, Inverter Machine, 90° PCB Transfer Buffer Loader & Unloader
New Equipment | Wave Soldering
Vitronics Soltec’s Delta platform has evolved over generations of equipment, with thousands of machines operating worldwide. The Delta 5 represents our latest wave soldering solution, featuring easy setup and operation and is the most reliable, depen
New Equipment | Solder Materials
eFlux Selection: Rosin Based Flux for Lead-Free Wave Soldering NS-F850. NS-F850 ensures excellent wetting of all PCB and component substrates to deliver maximum through hole fill and facilitates the solder drainage that ensures minimum bridges an
Electronics Forum | Thu Jun 25 11:11:13 EDT 2009 | bruna
Hello, I want to hear some experience about selective soldering for PCB using nozzle plate and screens Do you have solder defects? bridges and insufficient soldering? How do you combat that? and about the screens you have good quality? What is the f
Electronics Forum | Thu Dec 06 12:37:14 EST 2012 | deanm
We are having difficulty with bridging on a 2x50 pin 0.050" fine pitch connector using our selective soldering machine. It usually bridges at the end of the row, but sometimes it bridges all the pins together as it drags across (solid bridging). I
Used SMT Equipment | Soldering - Reflow
Vitronics 6622CC (Pb Free) Wave Soldering Machine Brand: Vitronics Model: 6622CC Vintage: 2001 Serial Number: 0103652201 LEADFREE unit Configured with Main Wave and Chip Wave Basic system according to General Specification (GS 235) CONTRO
Used SMT Equipment | Screen Printers
WATCH this industry leader out print them all NOW on our website under videos WINNER ! ! This system took the GLOBAL TECHNOLGY AWARD for 2011, presented at the Productronica show in Germany. Than took the Circuit Assembly award at the APEX Show 2
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Industry News | 2021-12-21 14:45:26.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1122 at the 2022 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place January 25-27, 2022, at the San Diego Convention Center.
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Parts & Supplies | Pick and Place/Feeders
Juki Tape Holder 12 ASM E33107060A0A E33107060A0A TAPE HPLDER 12 ASM E3308715000 CASING E3308780000 SPRING HOLDER E3309780000 BIT BRACKET E3310706000A TAPE HOLDER 12 E33107060A0 TAPE HOLDER 12 FF12 ASM →E33107060A0A E33107060A0A TAPE HO
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
ITW EAE, the Electronic Assembly Equipment division of ITW is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Selective Soldering Process Selective Soldering Process Although many through-hole components are being replaced by their surface mount (SMT) counterparts, printed circuit boards (PCBs) are still being designed with both types of components
Baja Bid | https://bajabid.com/wp-content/uploads/2021/09/Viscom-S3016-OEM.pdf
. The S3016 ultra is perfectly suited for inspecting SMD, THT and press- fit components as well as selective solder joints from below
| https://www.smtfactory.com/Three-questions-about-PCBA-What-is-the-meaning-of-PCBA-What-is-the-production-equipment-required-for-PCBA-What-is-the-PCBA-production-process-id43571387.html
& Place Machine JUKI Pick & Place Machine YAMAHA Pick & Place Machine PANASONIC Pick & Place Machine FUJI Pick & Place Machine I.C.T Pick & Place Machine SMT Peripherals DIP Machine Acrab Series W Series Automatic Insertion Machine Selective Wave Soldering Machine DIP Peripheral Equipment PCB Handling Machine Loaders
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