Industry Directory | Consultant / Service Provider / Manufacturer
Designer and Manufacturer of Hybrid RF Microelectronics
Seeger and Hosband is a small electronics contract manufacturer offering SMT and through hole circuit card assembly as well as cable harnesses, chassis assembly, and specialized items like transducers and thermister probe assemblies.
New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
Electronics Forum | Tue Aug 09 12:31:11 EDT 2005 | Rob
Are they being shadowed by larger components?
Electronics Forum | Fri Jun 06 03:30:11 EDT 2008 | lococost
What about shadow effects? How do you cure UV coat under components?
Used SMT Equipment | SPI / Solder Paste Inspection
Make: VI Technologies Model: 3D Solder Paste Inspection Vintage: 2009 Details: 1. FAHP (flying absolute height profilometry) measurement method 2. Dual light source and on the fly image scan 3. High power M/H light 3D sensor 4. Shadow free ins
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YOUNG KY8030-2 3D SPI The World's Best-selling Full 3D Solder Paste Inspection Best-in-class measurement accuracy and inspection reliability Solves shadow problems by utilizing 2-way projection Provides accurate inspection data with real-time P
Industry News | 2014-10-01 15:59:00.0
PCB provider Cirtech Electronics located in Cape Town, South Africa will be liquidating their assets utilizing the online auction services of GoIndustry and Baja Bid. Bidding for the auction will open promptly at 8:00am PDT on October 7th, 2014 and will begin closing at 6:00am PDT on October 14th, 2014.
Industry News | 2014-10-10 16:27:51.0
CB provider Cirtech Electronics will be liquidating their assets utilizing the online auction services of GoIndustry and Baja Bid.
Parts & Supplies | Pick and Place/Feeders
To provide customers with new JUKI mounting machine and SMT mounting equipment, supply new JUKI mounting machine, Samsung mounting machine, Panasonic mounting machine, FUJI mounting machine, YAMAHA mounting machine, Siemens mounting machine, MYDATA m
Technical Library | 2008-03-13 13:02:50.0
Three full-field optical techniques, shadow moiré, fringe projection and digital image correlation (DIC), are used to measure temperature-dependent warpage for a PBGA package and a PCB component land site from room temperature to 250ºC. The results are qualitatively similar, but imaging resolution and noise properties create offsets between coplanarity values. The paper summarizes strengths and weaknesses for each technique.
Technical Library | 2013-01-31 18:43:15.0
There are three key industry trends that are driving the need for temperature-dependent warpage measurement: the trend toward finer-pitch devices, the emergence of lead-free processing, and changes in device form factors. Warpage measurement has become a key measurement for analysis; prevention and prediction of interconnect defects and has been employed in failure analysis labs and production sites worldwide. First published in the 2012 IPC APEX EXPO technical conference proceedings
► Exclusive15MP / 25MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB
► Exclusive 15MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB Warpag
Events Calendar | Wed Apr 28 00:00:00 EDT 2021 - Wed Apr 28 00:00:00 EDT 2021 | ,
Continued Journey of Equality Expo
Events Calendar | Tue Nov 09 00:00:00 EST 2021 - Tue Nov 09 00:00:00 EST 2021 | ,
Boston Chapter Hybrid Meeting: OSAAP Shadowboard & Inlay Design Process for LEAN & 5S Applications
Career Center | Rockledge, Florida USA | Purchasing
Primarily responsible for overseeing the purchasing of materials required for production of PCB assemblies. Individual will establish new and alternative supply sources, and negotiate prices and delivery schedules. Individual will communicate with mu
Career Center | Rockledge, Florida USA | Sales/Marketing,Technical Support
Primarily responsible for providing effective customer service for all assigned customers by utilizing competent knowledge of PCB assembly process from quote to finished product. General Purpose: Customer relations, problem resolution, time managem
Career Center | Denton, TX-Texas USA | 2017-05-06 20:13:59.0
Engineering,Production,Quality Control
SMTnet Express January 31, 2013, Subscribers: 26152, Members: Companies: 9105, Users: 34242 Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages There are three key industry trends that are driving
Comparing techniques for temperature-dependent warpage measurement Comparing Techniques for Temperature-Dependent Warpage Measurement Three full-field optical techniques, shadow moiré, fringe projection and digital image correlation (DIC
Lewis & Clark | http://www.lewis-clark.com/product-tag/koh-young-ky8030/
, Area Optical Measurement Unit Koh Young proprietary light projection unit for shadow free effect Dual projection light source: strobe LED Vision Algorithm: 3D/PSMI And more
| https://www.smtfactory.com/I-C-T-High-Speed-on-Line-3D-SPI-Solder-Paste-Inspection-Equipment-I-C-T-S400-pd49143724.html
: I.C.T 3D SPI can completely solve the problem of shadow and random reflection in the detection process, so that solder paste 3D detection
