New Equipment | Assembly Services
Unique advanced long-time heating system 1. Equipped with high efficiency and energy saving Swedish NI-CR heating tube, radiation power peak wavelength 4 UM, with surface reflector, high thermal efficiency, temperature rise speed, the forced air cir
4 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
Electronics Forum | Thu Dec 16 04:14:16 EST 2010 | kemasta
Hi, I am new in this industrial. I learnt that PCB may absorb moisture and eventually caused delaminate after heat apply on it (reflow or wave). But I don't quite understand, if the PCB was keep in sealed bubble bag, and with the humidity control wit
Electronics Forum | Mon Jan 08 17:32:47 EST 2007 | Board House
Hi Oswald, Shelf life with ENIG if vacuum sealed and kept in controled enviroment would be 12 to 14 months. Shelf life in shrink wrap - No recomended packaging, 6 moths. If Shelf life goes over the 12 -14 months - Baking ? I would not suggest re-b
Industry News | 2008-04-29 23:10:39.0
Richardson, TX (April 29, 2008) ASSET� InterTech Inc. (www.asset-intertech.com) is developing and will bring to market open embedded instrumentation tools based on the preliminary IEEE standard, P1687 Internal JTAG (IJTAG). According to Glenn Woppman, president and CEO of ASSET, the standard is close enough to ratification to begin developing tools.
Industry News | 2009-12-10 01:05:59.0
Building on its successful lead-free solder products portfolio, Henkel has developed Multicore LF730, a Pb-free solder paste born from the company’s unyielding innovation commitment and arguably setting the benchmark for lead-free paste performance.
Technical Library | 2024-06-19 15:23:54.0
Each year the semiconductor industry routes a significant volume of devices to recycling sites for no reliability or quality rationale beyond the fact that those devices were stored on a warehouse shelf for two years. This study identifies the key risks attributed to extended storage of devices in uncontrolled indoor environments and the risk mitigation required to permit safe shelf-life extension. Component reliability was evaluated after extended storage to assure component solderability, MSL stability and die surface integrity. Packing materials were evaluated for customer use parameters as well as structural integrity and ESD properties. Results show that current packaging material (mold compound and leadframe) is sufficiently robust to protect the active integrated circuits for many decades and permit standard reflow solder assembly beyond 15 years. Standard packing materials (bags, desiccant, and humidity cards) are robust for a 32 month storage period that can be extended by repacking with fresh materials. Packing materials designed for long term storage are effective for more than five years.
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R
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