Industry Directory | Manufacturer
US manufacturer of metallized ceramic substrates & packages; specializing in PCTF (plated copper over thick film) & low cost AgENIG (silver with electroless nickel and immersion gold plating).
Industry Directory | Manufacturer
2Layers - 18Layers ;HASL, OSP, Gold plating, immersion Gold/Silver/Tin, removable mask, gold-finger, carbon ink;Conact Person:Rene E-mail:rene@speedingcircuit.com Website:www.speedingcircuit.com
New Equipment | Cleaning Equipment
Automatick Ultrasonic Stencil Cleaner BMP-1200 ▶All stainless steel body: beautiful, wear resistance, corrosion resistance, acid, alkaline and other cleaning fluid. Meet environmental protection requirements and standards. ▶Full pneumatic operation,
New Equipment | Soldering Robots
PLC Action and PC Picture Processing Optional Quickly Laser Tin-Ball Spraying Soldering Machine Product Parameter : Feeding Way Carry in or out track or on-line type or jig, single or double station Lase
Electronics Forum | Thu Aug 29 17:51:43 EDT 2002 | nifhail
I have seen several Imm Ag pad on the assembled board which have a copper colorleaching through the silver plating This happened on the pad which was not deposited with paste during the assembly process. Don't know if it is a problem, but we only h
Electronics Forum | Tue Apr 09 05:36:27 EDT 2002 | lhudson1
Silver in the paste is present to minimise any negative effects of silver in the pcb finish or component terminations. 2% Ag prevent silver leaching thus giving a more reliable joint.
Used SMT Equipment | General Purpose Equipment
Need SIEMEN Silver Feeder 3*8 Size Part number : 00141098-S07 Qty : 8 pcs Please send details : 1) Front & Back of Feeders 2) Close up showing the serial plate 3) Price CIF Singapore (for China supplier please send to SHENZHEN location) 4)
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: Panasonic Machine Model: AVK Auto Insert Machine Part Name: Pusher Part Number: 1020312044 Color: Silver Gray Location: China Pusher 1020312043/1020312044 AVK Panasonic AI Spare parts Standard Size Descript
Parts & Supplies | Pick and Place/Feeders
JUKI CTFR FEEDER PARTS 40081791 2MM_FEED_ASSY 1 40081823 4MM_FEED_ASSY 1 40081774 FEEDER_BASE_P_ASSY 1 40081785 FEEDER_BASE_E_ASSY 1 40081789 ADAPTER_PLATE_ASSY 1 40081851 TAPE_HOLDER_ASM 1 40081848 HOLDER_PLATE_ASM 1 40081847
Technical Library | 2014-06-23 14:50:52.0
It was unusual to see chip terminations change colors when tin lead solders were used but with the introduction of lead free reflow soldering and the corresponding increases in reflow temperatures terminations are now changing colors. Two conditions are present when reflow temperatures are increased for lead free solder alloys that leads to discoloration. Reflow temperatures are above the melting point of tin (Sn MP is 232oC). Air temperatures commonly used in forced convection reflow systems are high enough to both melt the tin plating on the termination allowing it to be pulled into the solder joint due to solder joint liquid solder surface tension leaving behind the exposed nickel barrier. Now those metal oxide colors will be visible due to high air temperatures during reflow.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_via-guidance-request-from-tim-c_topic538.xml
;If you do not mention the plug fill material in your fabrication notes, LPI solder mask is the default. But if you have high current you should probably request Dupont Silver Epoxy
| https://pcbasupplies.com/jm-20-sn60-pb40-0-3-mm/
% Flux type ROL0 Alloy composition (%) Sn 40Pb Halide content(%) 0.0 Silver chromate paper test No discoloration Solder spread factor
