New Equipment | Solder Materials
SPA1000 – Solder Paste Analyzer ( slump, tack, wetting, solder ball, spread), all-in-one test.
Electronics Forum | Thu Jan 03 08:02:53 EST 2002 | davef
Slump is a function of the particular paste you select and the temperature of the paste. Use a slump test like the one that follows to compare fluxes. Slump Test Step Process activity 1 Print paste on white ceramic substrate or microscope sli
Electronics Forum | Wed Sep 15 14:06:40 EDT 2004 | frankR.
Hi Rick, Last year I've test about 15 different solder paste. To procede, I've started with different tests listed in different brochure including IPC. At the biginning, I had 15 different tests to do and at the end ( for the last 7 product ) I've
Industry News | 2016-03-02 13:33:49.0
IPC announced today the January 2016 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales and orders slumped in January, but orders continued to outpace sales, bringing the book-to-bill ratio up to 1.04.
Industry News | 2013-06-28 18:52:56.0
IPC announced today the May findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. The PCB book-to-bill ratio stayed strong for the sixth consecutive month, remaining at 1.10, an indication that recovery from nearly a two-year slump may be starting.
Technical Library | 2014-10-02 20:10:07.0
Sn3.0Ag0.5Cu (SAC305) is the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years, the price of silver has dramatically increased driving a desire for lower silver alloy alternatives. As the results, there is a significant increase in the number of alternative low/no silver lead-free solder alloys available in the industry recently.In this paper, we'll present the performance and process capability of various low/no silver alloy solder pastes. Data from printability, wetting test, slump test, solder ball test, voiding, etc… will be discussed and compared with the control SAC305 solder paste. Benefits and concerns of using low/no silver alloy solder paste materials will also be addressed.
Events Calendar | Mon Feb 11 00:00:00 EST 2019 - Mon Feb 11 00:00:00 EST 2019 | ,
Webinar: Solder Paste Evaluation & Simple Tricks of the Trade
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
value of 1x108 Ω or greater. Slump Test defined in IPC TM-650 2.4.35 to measure the change in shape of solder paste after deposition and before reflow. Solder Balls Small spheres of solder that have separated from a solder deposit during reflow
| https://productronica.com/en/trade-fair/press/press-releases/detail/microelectronics-one-of-the-key-industries-of-our-time.html
), in 2020 the global microelectronics market grew by 6.8 percent compared to the previous year to USD 440 billion. And that’s despite a slump in the global economy of
