Ultra-high accuracy screen printing Panasonic's SP70 screen printer is designed for both high- and low-volume manufacturers who require ultra-high printing accuracy. PCBs up to 580 x 508mm are processed in a smaller footprint than previous SP-serie
SFG Electronic Technology Co.,Limited Contact:Andy Tung Cell phone/WhatsApp/Wechat:+86 13751093139 Skype:kelvin-andy Higher quality & higher productivity . . Further pursuing of high quality printing with "the cornerstone of quality is p
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
Electronics Forum | Sat Aug 27 09:47:05 EDT 2005 | davef
From the pic, we see blistering, but none so close to via that we'd attribute the blistering to via, via plugging, or anything of the sort. When we see blisters like this, we think of a surface contaminant being present on the boards at the time of
Industry News | 2016-09-14 17:44:33.0
IPC – Association Connecting Electronics Industries® will present “PCB Troubleshooting” on November 2, 2016 in Raleigh, N.C. in conjunction with regional trade show, PCB Carolina.
Industry News | 2018-03-24 09:45:36.0
Dendrite failure on printed circuit board assemblies is quite common but often not investigated fully to pin point the root cause. This is due to the intermittent nature of the failure or just replacing components seems to solve the problem Book at https://www.bobwillis.co.uk/event/dendrite-failure-causes-cures/
Technical Library | 2023-04-17 17:05:47.0
In an ideal world, manufacturing devices would work all of the time, however, every company receives customer returns for a variety of reasons. If these returned parts contributed to a fail, most companies will perform failure analysis (FA) on the returned parts to determine the root cause of the failure. Failure can occur for a multitude of reasons, for example: wear out, fatigue, design issues, manufacturing flaw or defect. This information is then used to improve the overall quality of the product and prevent reoccurrence. If no defect is found, it is possible that in fact the product has no defect. On the other hand, the defect could be elusive and the FA techniques insufficient to detect said deficiency. No-clean flux residues can cause intermittent or elusive, hard to find defects. In an attempt to understand the effects of no-clean flux residues from the secondary soldering and cleaning processes, a matrix of varying process and cleaning operation was investigated. Of special interest, traveling flux residues and entrapped residues were examined, as well as localized and batch cleaning processes. Various techniques were employed to test the remaining residues in order to assess their propensity to cause a latent failure. These techniques include Surface Insulation Resistance1 (SIR) testing at 40⁰C/90% RH, 5 VDC bias along with C32 testing and Ion Exchange Chromatography (IC). These techniques facilitate the assessment of the capillary effect the tight spacing these component structures have when flux residues are present. It is expected that dendritic shorting and measurable current leakage will occur, indicating a failing SIR test. However, since the residue resides under the discrete components, there will be no visual evidence of dendritic growth or metal migration.
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JUKI Chip Mounter Maintenance and Troubleshooting JUKI Chip Mounter programming MINAMI Solder Paste Printer Maintenance and Troubleshooting MINAMI Solder Paste Printer programming PWB Loader / Unloader Maintenance and Troubleshooting TAMURA Reflow ma
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A Six Sigma Green Belt practitioner with high experience in process,quality and production engineering.
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
SMTA Wisconsin Chapter Free! 2020 Solder Reflow Fundamentals Fred Dimock Free! 2020 Introverted Leadership Karyn Ross, Karyn Ross Consulting
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