Independent UK manufacturer of Solder Paste, High Purity Bar Solder, Solder Wire (Solid and Cored), fluxes and cleaners. Warton manufacture lead free and lead based alloys for electronics manufacturing. Full technical support available.
Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin
Electronics Forum | Thu Apr 01 10:49:14 EST 1999 | AF Ng
| Has anyone heard of a problem with catastrophic failure of | large value (200uF) solid tantulum capacitors that have been | exsposed to high humdity. | I suppose that with water moisture seep in the capacitor, the risk is very high that abrupt o
Electronics Forum | Thu Apr 01 14:00:17 EST 1999 | Ron Beasley
| | Has anyone heard of a problem with catastrophic failure of | | large value (200uF) solid tantulum capacitors that have been | | exsposed to high humdity. | | | I suppose that with water moisture seep in the capacitor, the risk is very high tha
Used SMT Equipment | SPI / Solder Paste Inspection
Very Nice Cyberoptics LSM For Sale in Good Working Conditon See attached pictures and information below. •Cyberoptics •Model Number: LSM/LRGE-110 •Serial Number: 5718 •Year December 1994 •Type:Laser Section Microscope •Measures Solder Paste H
Used SMT Equipment | Soldering - Reflow
Heating zones: 5 Cooling zones: 2 Total heating length: 66 in. Total cooling length: 26 in. Total process length: 127 in. Total on /off load length: 11 in. Overall system length: 138.5 in. Overall system width: 52 in. Overall system height: 5
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2003-04-04 07:39:52.0
Designated T11L these have soldered connections for PCB circuits with a grid of 0.2 pitch
Parts & Supplies | Other Equipment
SMT Printer Squeegee MPM 125 MPM 125 Printer Squeegee 1.for MPM screen printer, 2.stainless steel blade 3.Size 219/254/300/304/355/400/450/508 4.Accurate durable 5.Abnormal is ok In order to enhance the control of the pre-placement prin
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Parts & Supplies | Assembly Accessories
CAMERA PROTECTING MASK N610008157AA AI splicing masking tape (2000pcs/roll) AIS-2000 CAMERA PROTECTING MASK N610008157AA Disposable Mask KF 17.5*9.5 CM KN95 Face Mask MASK & PCB CLEANING SYSTEM MOREL 280 C&
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2019-05-23 10:42:00.0
Why identify flux residues? The primary purpose of flux is to reduce species of metal oxides from solderable surfaces, and to act as a mechanism for lifting and removing debris. If the assembly is not properly cleaned after manufacturing, flux may continue to reduce metals and may eventually corrode the assembly. When the assembly is powered, the metal ions may precipitate along electromagnetic field lines and form dendritic shorts. In addition, the presence of residue can alter the insulation properties of a board, affect the adhesion of the conformal coating, or interfere with the moving parts of the assembly. In radio frequency (RF) applications, flux may change the RF properties on the surface of the printed circuit board (PCB) such as the dielectric strength, surface resistance, and Q-resonance.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Wed May 15 00:00:00 EDT 2019 - Fri May 17 00:00:00 EDT 2019 | Seoul, South Korea
Electronics Manufacturing Korea - Korea's largest electronics manufacturing exhibition
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: Experience in solid Edge CAD/CAM 3D system software and electronic packaging, Prior experience designing packaging systems a plus. Duties/Functions: Responsibility for the design of mechanical systems for electronic packaging. W
Career Center | , Maryland USA | Engineering
Late stage start-up company, well into commercialization, that develops and manufactures products to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Building from its strengths in material
Career Center | Williamsburg, Kentucky USA | Engineering,Production,Quality Control
SKILLS My computer skills are fluent with experience in Microsoft Word, Internet, WordPerfect and Microsoft Works. I have an extensive electronics background. I can type 40 wpm. I am multi-skilled with a vast knowledge in electronics and over 10 y
Career Center | Williamsburg, Kentucky USA | Engineering,Production,Quality Control
SKILLS My computer skills are fluent with experience in Microsoft Word, Internet, WordPerfect and Microsoft Works. I have an extensive electronics background. I can type 40 wpm. I am multi-skilled with a vast knowledge in electronics and over 10 y
Heller Industries Inc. | https://hellerindustries.com/parts/2566k/
2566K - SOLID STATE RELAY Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/matrix/industries/metal-fabrication
Metal Fabrication Nordson Automatic X-Ray Products Corporate | Global Directory Division Only All of Nordson Products Inline X-ray Inspection Systems ● X Series ● X# Series
