Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Industry Directory | Equipment Dealer / Broker / Auctions
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Electronics Forum | Tue Sep 22 10:05:00 EDT 2009 | roland_grenier
Does anyone know how to calculate solder paste volume required to run a PCBA on an SMT line? I'm looking for a solder paste volume model which include paste waste. Roland
Electronics Forum | Wed Aug 13 06:41:06 EDT 2008 | lonta96
thanks pete, i have requested information from their local rep in our place. However, from the response that i got, the volume data you get in their VM system is a calculated value, not a true volume measurement.
Used SMT Equipment | X-Ray Inspection
Test Research TRI, TR 7006L 3D Solder Paste Inspection, Located In Fremont, CA An auction item: bidding on this listing starts on Wednesday, September 20, 2017 6:00:00 AM
Used SMT Equipment | SPI / Solder Paste Inspection
This machine is included in our December 6 - 9 online auction. Please visit the below website for all of the details on this machine. https://bajabid.hibid.com/lot/106777072/2016-cyberoptics-se600-3d-spi
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | SPI / Solder Paste Inspection
Koh Young Calibration jig SPI /AOI CALIBRATION FEE CALIBRATION FEE NXT/XPF Feeder Calibration Jig ..NXT/XPF-FCS YV feeder calibration jig ..YV feeder calibration jig CL Feeder calibration ..YMH CL YAMAHA SS feeder calibration jig SS
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-08-16 18:16:05.0
A global aerospace and defense leader requested a capability test of small volume solder paste dispensing on FR4 circuit boards.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Hawthorne, California USA | Production
MANUFACTURING SPECIALIST (STARLINK) Hawthorne, CA, United States SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively develop
Career Center | Racine, Wisconsin USA | Engineering
Cree currently has a job vacancy for an SMT Operator in our Lighting Manufacturing facility in Racine, Wisconsin. Location: Racine, WI Shift: 7AM - 3PM (Monday - Friday) Full-time w/benefits! Summary: This person will be a primary contribut
Career Center | , India | Engineering,Maintenance,Production,Technical Support
Hands on experience in PLC based machine, DEK Printer Machine, Camlot Glue dot machine, Fuji NXT, SPI machine, reflow: Vitronics XPM2/3, Expertise in SMT Profiling Qualification & NPI Build, Soldering defects, Analysis & rework. Line modifi
Career Center | Chandigarh, India | Engineering,Maintenance,Management,Production,Technical Support
1.Installation of Machines at Customer Workshop / Work area. 2.Provide training to the customer on Machines after Installation. 3.Meticulously Maintaining the AMC contract, spare parts inventory of the all SMT Machines. 4.Ensuring maximum customer s
investigates the scooping effect during solder paste print
Lewis & Clark | http://www.lewis-clark.com/product-category/spi/
SPI- Solder Paste Inspection Systems Archives - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal
GPD Global | https://www.gpd-global.com/small-volume-dispensing.php
Small Volume Dispensing 01005 Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
