New Equipment | Education/Training
BEST offers a one of a kind mobile training center which allows the students to be sequestered inside the training center without outside distrction. In addtion the mobile traiing enter on wheels is a comfortabel place to train where all of the most
Electronics Forum | Fri Aug 17 09:35:15 EDT 2007 | karenp
We usually do Solder reworks, and some components that cannot be installed by SMT Machines or Wave solder due to specs or the technology in our company... aur work methods and instruction are always based on designators and are more illustrated to ca
Electronics Forum | Wed Mar 20 07:14:10 EDT 2013 | vinitverma
Assembleon AX201 is one of the most accurate odd-form placer. It can place anything, including leaded transformers, press-fit connectors, and of course odd form SMT components. You can even use a gripper nozzle for components without a flat surface t
Industry News | 2012-11-29 14:23:04.0
Count On Tools Incannounces a limited time offer on its new products. Just use coupon code PROMO20** to receive a 20 percent discount.
Industry News | 2022-01-10 16:55:15.0
The SMTA Capital Chapter Officer team is excited to provide our members with a free technical webinar on "Use of Photonic Soldering to Rework Chip Components" presented by Dr. Vahid Akhavan, Global Application Engineer at NovaCentrix. The presentation will take place on January 20th at 12:00am EST.
Technical Library | 2021-03-18 20:07:08.0
X-ray tomography is a promising technique that can provide micron level, internal structure, and three dimensional (3D) information of an integrated circuit (IC) component without the need for serial sectioning or decapsulation. This is especially useful for counterfeit IC detection as demonstrated by recent work. Although the components remain physically intact during tomography, the effect of radiation on the electrical functionality is not yet fully investigated. In this paper we analyze the impact of X-ray tomography on the reliability of ICs with different fabrication technologies.
Technical Library | 2021-12-29 19:52:50.0
Medtronic seeks to quantify the thermal aging limits of electroless Ni-electroless Pd-immersion Au (ENEPIG) surface finishes to determine how aggressive the silicon burn-in process can be without loss of solderability. Silicon burn-in (power testing at elevated temperature) is used to eliminate early field failures, critical for device reliability. Thermal aging due to burn-in or annealing causes Ni and Pd diffusion to and oxidation on the surface. Surface oxides limit wetting of the PbSn solder, affecting electrical connectivity of components soldered afterburn-in. Isothermal aging of two ENEPIG surface finishes was performed at 75°C-150°C for 100 hrs-1500hrs to test the thermal aging limits and identify how loss of solderability occurs.
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it was clear. An SMD component was placed on the surface o
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588414-01 - GEN 5.1 FLUX COLLECTOR COMPONENTS Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
