Industry Directory | Manufacturer
Cookson Electronics is a leading materials science company that provides high performance materials, Soldering Pastes
Dynapert, Universal, TDK, Spare Parts, Bandoliering Tape, Auto-Insertion and SMT Machine , Sanyo, Fuji, Iemme, Yokota, Electrovert, Taiwan, V12000, UCSM-G, VCD, Titanium Fingers For Wave Soldering Machines, Sensbey, Engineering Services For PCBA mac
New Equipment | Test Equipment
Koh Young ZENITH Alpha UHS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 12M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
New Equipment | Test Equipment
Koh Young ZENITH Alpha HS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 8M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330m
Electronics Forum | Tue Dec 27 15:07:28 EST 2016 | luciano
Hello, Sorry for the mistake. The speed is 1m/min. We are using Alpha Vaculoy solder and a conveyor angle about 7º. We are not using pallets since the fingers hold the boards directly. Thanks!
Electronics Forum | Thu Jan 08 15:03:40 EST 2004 | dwzeek
We have an ongoing problem with our QFP144 packages soldering. It has not received much attention until late due to some customer failures. Most of the failures would show up in ESS testing and be repaired. The failure rate is about 2 in 1000 parts f
Used SMT Equipment | Soldering - Selective
ACE KISS-104 Dual Pot Selective Solder System; Includes: (1) Lead Free & (1) Leaded Solder Pot; Vintage: Sept. 2008;; Nitrogen; Top Pre-heater; Setup & Witness Cameras, Manual, (3) Rolls of Alpha Metals Solder and Tool Kit
Used SMT Equipment | Soldering - Wave
ERSA Powerflow ATM – 2009 Vintage 06-2009 Serial number: W034A-09F0027 Configuration: Palletconveyor Fluxer with custom flux measurement system Pre-heater’s; Bottom Leadfree; Alpha SACX Plus 0807
Industry News | 2003-02-17 08:40:25.0
To Meet Government Environmental Standards and Individual Company Policies, While Satisfying Production Requirements
Industry News | 2020-01-08 16:51:58.0
The SMTA Capital Chapter is excited to host a Chapter Meeting on February 20th from 5:00 PM to 7:30 PM at PACE Worldwide in Elkridge, MD. Jason Fullerton, MacDermid Alpha Electronic Solutions, will be presenting “Advances in Lead-Free Solder Technologies for High Reliability Applications.”
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2019-10-16 23:18:15.0
Despite being a continuous subject of discussion, the existence of voids and their effect on solder joint reliability has always been controversial. In this work we revisit previous works on the various types of voids, their origins and their effect on thermo-mechanical properties of solder joints. We focus on macro voids, intermetallics micro voids, and shrinkage voids, which result from solder paste and alloy characteristics. We compare results from the literature to our own experimental data, and use fatigue-crack initiation and propagation theory to support our findings. Through a series of examples, we show that size and location of macro voids are not the primary factor affecting solder joint mechanical and thermal fatigue life. Indeed, we observe that when these voids area conforms to the IPC-A-610 (D or F) or IPC-7095A standards, macro voids do not have any significant effect on thermal cycling or drop shock performance.
Adding ALPHA® solder preforms to solder paste can result in complete hole fill in electronic assembly pin in through hole soldering applications. www.alpha.alent/products/preforms
ALPHA® Preforms with solder paste adds solder volume.
Career Center | South Plainfield, New Jersey USA | Research and Development
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | South Plainfield, New Jersey USA | Research and Development
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
Career Center | Calamba City, Laguna Philippines | Engineering
Electronic Manufacturing Services (EMS) – SMT-EOL Process Engineer (August 2005 – Present) • Responsible for feasibility study for existing product and new product and conceptualize product assembly or process flow taking into consideration the manu
on volume delivery and positioning accuracy for solder p
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/news/nordson-select-to-present-at-southern-germany-soldering-forum
The controlled selective soldering process, Philipp Grosse, Area Sales Manager DACH, Nordson SELECT GmbH Quality assurance by process-optimized choice of soldering materials, Alan Plant, Regional Applications Manager Europe, Alpha Assembly Solutions
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
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