Assembly Partner produces high quality electronics. But we can do more than execute orders and put 'kits' together. We can provide total solutions, even if we have to look beyond the beaten track.
Industry Directory | Manufacturer
Manufacturer of Selective Soldering Systems, Ersascope BGA Inspection Systems, BGA Rework Systems, Soldering Irons, Wave Solder and Reflow Equipment.
YSC PowerScope US209 is the ultimate digital microscope that can be customized with various camera, lighting, stand, software, and measurement options. The lens offers superior resolution and depth of field with detent click stop feature, which is id
Packed with innovative placement and vision technologies, Assembleon provides optimum flexibility for any medium/high-volume production environment. When speed is not the main priority... But feeder positions and component range are Opal-XII is the
Electronics Forum | Tue Oct 08 01:51:08 EDT 2019 | robl
Hi Alexey, I've used Combi machines too, but Universal were still selling new 2596D sequencers in 2003, way after the 6241D,E & F: http://www3.uic.com/wcms/Images.nsf/(GraphicLib)/366-00B.pdf/$File/366-00B.pdf
Electronics Forum | Thu Feb 14 04:40:38 EST 2008 | lococost
You want the backplate set up so that when there's no PCB the wave stands still or moves towards the PCB. When the PCB moves over the wave, it should just pull the wave towards the back (in the same direction as the PCB). This will help reduce brid
Used SMT Equipment | THT Equipment
Universal Instruments Corporation Radial 5 6360E instertion machine Stand Alone, Standard 2.5/5.0 insertion tooling, manuals, software and adjustable work board holder, still under power, in good working condition. FOB: Origin AssuredTechnicalServi
Used SMT Equipment | Pick and Place/Feeders
We purchase original factory excess inventory from various companies that have discontinued products that are still currently active in the field. The purpose of our company is to extend the life of your equipment investment at a much lower cost tha
Industry News | 2023-10-16 12:50:01.0
MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!
Industry News | 2003-09-11 16:50:12.0
The printed circuit board industry is an ever-changing marketplace. The technologies of today certainly aren�t standing still, and neither should today�s PCB designer
Parts & Supplies | Pick and Place/Feeders
N210136905AB PLATE 0 N610124004AA フレキシブルコンベアステーション(搬送部)IPC対応 Flexible Conveyor St (Trannsport Unit) For IPC:NPM-D N210081910AB PLATE 0 N610087916AA 荷重キャリブレーションジグ Load Calibration Jig N210155534AA BRACKET 0 N610073135AA 交換台車切替ユニットガイド部:NPM Feeder
Parts & Supplies | Pick and Place/Feeders
The Chessel Store purchases original factory excess inventory from various companies that have discontinued products that are still currently active in the field. The purpose of our company is to extend the life of your equipment investment at a much
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
Compact and optimised for simple Gluing and Dispensing Tasks The DesktopCell is a compact, integrated solution for small to medium-sized batches and for prototype production. It unites all the advantages of a fully fledged dispensing cell and a smal
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/trim-pad-under-component-feature_topic574_post1844.html
. However, you can still "Trim Pads" in the Footprint Expert if you want to. i.e.: The "Trim Pad" feature is still there, the component stand-off default value is set to zero "0
GPD Global | https://www.gpd-global.com/co_website/pdf/dispense/Process-View-Camera.pdf
dispense system for easy viewing at the machine or from across the room. Process View Cameras are compatible with both inline and stand-alone dispense system configurations
