Industry Directory | Consultant / Service Provider
KIC's provides products and services designed to improve a variety of thermal monitoring, profiling and process control applications.
Industry Directory | Consultant / Service Provider / Manufacturer
ECD is recognized worldwide for its leadership and expertise in thermal monitoring and analysis technology. The company is a pioneer in the design, development, and manufacturing of advanced thermal profiling systems and software.
Dual Chamber Module - Dual Chambers + Dual Blowers + Dual Heaters + Dual T/Cs. Bifurcated (Dual) chamber reflow oven allows 2 different thermal profiles to run simultaneously in the same reflow oven foot print Improved temperature uniformity acro
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Electronics Forum | Thu Apr 09 12:11:19 EDT 1998 | raymond
Does anyone has any experience using the Prophet Thermal Manager by KIC Thermal Profiling for real time monitoring and control of reflow oven profile ?
Electronics Forum | Thu Apr 09 12:35:16 EDT 1998 | Earl Moon
| Does anyone has any experience using the Prophet Thermal Manager by KIC Thermal Profiling for real time monitoring and control of reflow oven profile ? Yes. What is your concern. Earl Moon
Used SMT Equipment | Soldering - Selective
Pillarhouse Jade MKII Selective Soldering Machine Model: Jade MKII Year: 2016 Lead-Free Drop Jet Fluxer Top Side IR Pre-Heat Auto Soler Top-Up & Solder Level Detect Inerted Nitrogen System Thermal Nozzle Calibrati
Used SMT Equipment | Labeling Systems
Zebra Technologies 170Xi4 Thermal Barcode Label Printer Brand: Zebra Model: Technologies 170Xi4 Type: Label Printer Printer Specifications: Resolution: 300 dpi (12 dots / mm) Memory: 16 MB SDRAM, 8 MB Flash Print Width: 6.6′ (168 mm) maximum
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2016-06-27 14:59:09.0
GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.
Parts & Supplies | Chipshooters / Chip Mounters
> JUKI ESL13000000 VACUUM PAD 15 JUKI ESL13000100 PHOTO MICRO SENSOR A JUKI ESL13001000 TUBE union (KL700) JUKI ESL130011A0 CONVEYOR MOTOR (KZ500) JUKI ESL13002000 CLAMP LEVER JUKI ESL13003000 T TYPE NUT JUKI ESL130031A0 OPERATION PANEL (KL700) JUKI
Parts & Supplies | Pick and Place/Feeders
JUKI 710 head motherboard E8621715BA0 E86227150A0 Other juki parts: E86217210A0 BGA BOARD ASM E86217290A0 TEMPERATURE SENSOR PWB ASM. E86227150A0 HEAD SUB UNIT BASE ASM. E86227290A0 LIGHT 2 PWB ASM. E86237000A0 HEAD RELAY CIRCUIT BOARD ASM E86
Technical Library | 2022-10-11 20:29:31.0
Electronic assemblies deployed in harsh environments may be subjected to multiple thermal environments during the use-life of the equipment. Often the equipment may not have any macro-indicators of damage such as cracks or delamination. Quantiication of thermal environments during use-life is often not feasible because of the data-capture and storage requirements, and the overhead on core-system functionality. There is need for tools and techniques to quantify damage in deployed systems in absence of macro-indicators of damage without knowledge of prior stress history. The presented PHM framework is targeted towards high reliability applications such as avionic and space systems. In this paper, Sn3.0Ag0.5Cu alloy packages have been subjected to multiple thermal cycling environments including -55 to 125C and 0 to 100C. Assemblies investigated include area-array packages soldered on FR4 printed circuit cards. The methodology involves the use of condition monitoring devices, for gathering data on damage pre-cursors at periodic intervals. Damage-state interrogation technique has been developed based on the Levenberg-Marquardt Algorithm in conjunction with the microstructural damage evolution proxies. The presented technique is applicable to electronic assemblies which have been deployed on one thermal environment, then withdrawn from service and targeted for redeployment in a different thermal environment. Test cases have been presented to demonstrate the viability of the technique for assessment of prior damage, operational readiness and residual life for assemblies exposed to multiple thermo-mechanical environments. Prognosticated prior damage and the residual life show good correlation with experimental data, demonstrating the validity of the presented technique for multiple thermo-mechanical environments.
Nano-copper sintering in formic acid vapor.
A demo of the Shuttle Star SV560 A BGA Rework Station.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Jun 22 00:00:00 EDT 2022 - Wed Jun 22 00:00:00 EDT 2022 | ,
Empire Chapter Webinar: LIVE Action Reflow Focused Process
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Career Center | , Texas USA | Engineering,Maintenance,Production,Technical Support
Rehm USA LLC sells and services thermal processing equipment for the electronics manufacturing industry. As part of Rehm Anlagenbau GmbH, Rehm USA extends the Rehm product line to the North America market and provides the highest quality service. Jo
Career Center | Grand Rapids, Michigan USA | Engineering
MAIN DUTIES: Performs new process development, monitors and maintains the processes in all areas of manufacturing including, but not limited to assembly, soldering, conformal coating, prep and related equipment. Responsible for generating, i
Career Center | , Florida USA | Engineering,Management,Quality Control,Research and Development,Technical Support
Resourceful, innovative professional with over 15 years in the Electronic Industry, with domestic and international experience. Expertise in initiating projects and programs that boost efficiency and productivity while expanding employee education.
Career Center | Stoneham, Massachusetts | Engineering,Production,Research and Development,Technical Support
Warren P. Pumyea 8 Beacon Street Stoneham, Massachusetts 02180 Cell #: 978-821-7335 * E-mail: warren@pumyea.com http://www.pumyea.com/Process_Manufacturing_Engineer.doc Objective: Seeking a position as an engineer or related discipline whic
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/measuring-and-verifying?con=t&page=34
Monitor Manufacturing - Industrial Monitoring Systems | Nordson Nordson Corporation Global Directory | Languages NASDAQ $218.03 -1.80 Our Products Our Industries Our Applications Brands
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
, continuous monitoring during thermal cycling. Thermal cycling was done in accordance with the IPC-9701A guideline [22]. The solder joints were monitored using an event detector set at a resistance limit of 1000 ohms. The failure data are reported as