Industry Directory | Manufacturer
Beijing Hanson Electronic Co., ltd, established in 2001 is located in Beijing Shangdi High Technology Area and covers 1000㎡. Being a high-tech enterprise, Hanson is devoted to design, manufacture and
Industry Directory | Manufacturer
RIGHT CHOICE, RIGHT PRICE, RIGHT NOW, JUST 1 CLICK ! E-MAIL: oneclickmachine@gmail.com skype : 1clickmachine Website: www.1clickmachine.com
SMT Research Inc. repairs an assortment of Universal GSM Nozzles. All items are unconditionally guaranteed. UNIVERSAL GSM Nozzle Repairs UNIVERSAL PN SMT RESEARCH PN & DESCRIPTION REPAIR 042F NU-1042R 042F nozz
New Equipment | Board Handling - Conveyors
Magazine loading / unloading system with magazine buffer and automatic magazine change The unit consists of two loading/unloading conveyors for magazines, a lifting axle with a magazine platform a transfer conveyor to the following unit and an elect
Electronics Forum | Mon Dec 05 09:14:14 EST 2022 | peterm
Invoke. The PTF Setup Procedure dialog box displays. 4. Select Product. The Select Product File dialog box displays. 5. Select the same product used in the Open PTF Teach Product section above. 6. Enter the Slot number for the PTF and select Full
Electronics Forum | Wed Mar 27 09:57:08 EDT 2019 | dilogic
Yes, you can. However, if you go above designed, limits you might either break something or it won't operate as you expect. There are settings for each servo loop on the machine and you can play with acceleration, speeds etc. Not sure that it's smart
Used SMT Equipment | SMT Equipment
Product name: YS100 high speed universal module chip mounter Product number: YS100 Products in detail The characteristics of 25000 CPH (equivalent to 0.14 seconds/CHIP: best conditions) ability of high speed SMT All the time, SMT absolute a
Used SMT Equipment | SMT Equipment
Product name: YS100 high speed universal module chip mounter Product number: YS100 Products in detail The characteristics of 25000 CPH (equivalent to 0.14 seconds/CHIP: best conditions) ability of high speed SMT All the time, SMT absolute a
Industry News | 2003-04-28 07:47:37.0
DPAC exceeds requirements of Sarbanes-Oxley Act in independence and financial expertise for the DPAC Technologies Board
Industry News | 2003-05-08 07:11:45.0
InDigiNet Signs Definitive Commitment Letter With UBC To Acquire 2.5million in Assets and business Interests plus revenues of Universal Broadband Communications.
Parts & Supplies | Other Equipment
1.Product name: panasert ai parts 2.Original: China 3.Model No:5323035S01 Brand Name: panasert This company specialized production, PANASERT(AJ.AVB.AVF.AVG.AV.AVK.AVK2 RT.JV.J , VK.JVK3.RH.RH3.RH6.RHS .RHS2B .RG131.RL131).UNIVERSAL(2596*.6287.
Parts & Supplies | Other Equipment
Brand Name: panasert 1.Product name: panasert ai parts 2.Original: China 3.Model No:1310061 Brand Name: panasert This company specialized production, PANASERT(AJ.AVB.AVF.AVG.AV.AVK.AVK2 RT.JV.J , VK.JVK3.RH.RH3.RH6.RHS .RHS2B .RG131.RL131).
Technical Library | 2022-10-31 17:25:37.0
Mixed formulation solder alloys refer to specific combinations of Sn-37Pb and SAC305 (96.5Sn–3.0Ag–0.5Cu). They present a solution for the interim period before Pb-free electronic assemblies are universally accepted. In this work, the surfaces of mixed formulation solder alloys have been studied by in situ and real-time Auger electron spectroscopy as a function of temperature as the alloys are raised above the melting point. With increasing temperature, there is a growing fraction of low-level, bulk contaminants that segregate to the alloy surfaces. In particular, the amount of surface C is nearly _50–60 at. % C at the melting point. The segregating impurities inhibit solderability by providing a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. VC 2011 American Vacuum Society. [DOI: 10.1116/1.3584821]
ML-2500S PCB Separator uses high speed rotation milling cutter to separate PCB array. Widely applied in digital, communication, lighting, etc. Which improved the defect on PCB separating caused by manual, V-cut, stamping, etc If you have any questi
Please check the video of Leadsmt complete online smd line , Lead-2206 online general pick and place machine with vision check system apply to all kinds of electronics with feeders only max 14 pcs . so any smt/smd pcb less than 14 pcs of components ,
Events Calendar | Thu Oct 14 00:00:00 EDT 2021 - Thu Oct 14 00:00:00 EDT 2021 | ,
Oregon Chapter Webinar: Supplier Relationship Management (SRM) During Crisis!
Events Calendar | Thu Oct 21 00:00:00 EDT 2021 - Thu Oct 21 00:00:00 EDT 2021 | ,
Great Lakes Chapter Webinar: Low Melting Alloy & Selection of the Right Chemistry for Reliability
Career Center | Detroit Metro area, Michigan USA | Engineering,Maintenance,Production,Technical Support
Technicians from entry level to senior level pro's. Prefer experience with one or more of the following OEM Equipment brands. Universal Instruments Speedprint Europlacer SMT (of Germany) Reflow Ovens Sanyo Panasonic DEK
Career Center | Magnolia, Texas USA | Engineering,Maintenance,Technical Support
IBE SMT Equipment, a leading SMT Equipment Dealer, located in Magnolia, TX is seeking a full time SMT Technician/Engineer. The SMT Technician/Engineer would be responsible for troubleshooting, repair, calibration, maintenance and occasional field se
Career Center | SAS NAGAR MOHALI, India | Production
PRODUCTION, MAINTENANCE, PROGRAMMING
Career Center | Singapore, Singapore | Technical Support
I have good skill with Technical oriented. Please check my resume.
---> SMT Express, Volume 3, Issue No. 6 - from SMTnet.com Volume 3, Issue No. 6 Friday, June 15, 2001 Featured Article Return to Front Page PCB Assembly Techniques by Harvey Twyman , University of Kent at Canterbury "I'm sure you
and Low IO Flip Chip Assemblies Universal Instruments C
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