Electronics Forum | Thu Mar 25 12:34:26 EDT 2010 | bgaguy
the voids will cause a long term relability problem as the part will not be correctly heatsinked. Change your stencil aperature to a "+" sign 15-20 mils wide in the center of the pad. ___________ : | : : | : :----|----: : | : :__
Electronics Forum | Wed Mar 15 08:18:29 EDT 2017 | rob
It's well documented in higher power semiconductors where thermal interface materials are used, such as SIL pads, thermal grease etc. There are a couple of papers on the effects of voiding on MOSFET performance, but I haven't got around to reading
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