New Equipment | Test Equipment - Bond Testers
• 100~130kV 5µm closed X-ray tube, high sensitive image intensifier with 200M mega pixels CCD camera • Multi-function workstation with±70° tilt and X-Y-Z-Q-M multi-axis movement and CNC auto-detect &bu
New Equipment | Test Equipment
feature • 100~130kV 5µm closed X-ray tube, high sensitive image intensifier with 200M mega pixels CCD camera • Multi-function intensifier with±60° tilt imitat
Industry News | 2011-12-14 15:47:27.0
Featuring new research and innovations in printed board design and manufacturing, electronics assembly and test, the IPC APEX EXPO® technical conference will be held at the San Diego Convention Center, February 28-March 1, 2012.
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2012-12-06 17:36:37.0
Inspection of integrated power electronics equals sophisticated test task. X-ray inspection based on 2D / 2.5D principles not utilizable. Full 3D inspection with adapted image capturing and reconstruction is necessary for test task.... First published in the 2012 IPC APEX EXPO technical conference proceedings.
ON Semi New and Original in MBRB1545CT Stock IC D2PAK-2 21+ package MBRB1545CT Schottky Power Rectifier, Switch-mode, 15 A, 45 V 2. All we sell are original and new inventories in-stock,includes ICs and Modules,etc 3. Selling Brands: TI, SEMIKR
Covering the industrial chain of power semiconductor materials, chips, modules, equipment and other industries, dozens of enterprises from home and abroad participated in the exhibition. This series of products can control the welding cavity rate of
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
APEX 2006, S31-03-01 to S31-03-10. [12] D. R. Banks, T. E. Burnette, Y. Cho, W. T. DeMarco, and A. J. Mawer, “Effect of Solder Joint Voiding on Plastic To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL. Ball
| https://www.eptac.com/faqs/ask-helena-leo/ask/smt-components-during-reflow-float-off-pads
: We install D-Paks on a number of boards (8.3.14 in IPC-A-610). These parts have a tendency to float during reflow. We have done quite a bit of process work to minimize the floating, but parts do still occasionally float and are... Question
