Electronics Forum | Tue Jan 21 16:28:02 EST 2003 | tony_sauve
Sorry I didn't close this one off last year... We had some failure analysis done on these PCB's ( 3D x-ray,microsectioning,SEM) and the results definitively proved that there was some contamination @ the base of the uvia's that had the voiding. It ap
Electronics Forum | Sat Nov 24 22:15:16 EST 2001 | Glenn Robertson
Tony, I'm not sure if even baking will stop the voids if you have gaps in the plating. It probably doesn't take much moisture or even trapped air. I'm not speaking from a lot of direct experience here, so please run the tests and let us know wh
Industry News | 2011-12-14 15:47:27.0
Featuring new research and innovations in printed board design and manufacturing, electronics assembly and test, the IPC APEX EXPO® technical conference will be held at the San Diego Convention Center, February 28-March 1, 2012.
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2012-12-06 17:36:37.0
Inspection of integrated power electronics equals sophisticated test task. X-ray inspection based on 2D / 2.5D principles not utilizable. Full 3D inspection with adapted image capturing and reconstruction is necessary for test task.... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Covering the industrial chain of power semiconductor materials, chips, modules, equipment and other industries, dozens of enterprises from home and abroad participated in the exhibition. This series of products can control the welding cavity rate of
TI New and Original CC2640R2FRGZR in Stock IC VQFN48,21+ package CC2640R2FRGZR SimpleLink™ 32-bit Arm Cortex-M3 Bluetooth® Low Energy Wireless MCU with 128kB Flash and 275kB ROM TPS65321AQPWPRQ1 HTSSOP14 TI 22+ DS2482S-100+T&R SOIC-8 Maxim 2
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
APEX 2006, S31-03-01 to S31-03-10. [12] D. R. Banks, T. E. Burnette, Y. Cho, W. T. DeMarco, and A. J. Mawer, “Effect of Solder Joint Voiding on Plastic To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL. Ball
| https://www.eptac.com/faqs/ask-helena-leo/ask/smt-components-during-reflow-float-off-pads
: We install D-Paks on a number of boards (8.3.14 in IPC-A-610). These parts have a tendency to float during reflow. We have done quite a bit of process work to minimize the floating, but parts do still occasionally float and are... Question
