New Equipment | Rework & Repair Services
Reliable LGA Rework Services to Rescue Your Project BEST is your source for LGA rework services. We can optimize our processes to make sure voiding is minimized and the interconnection to all of the IO meets the IPC classification for the assembly.
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
Electronics Forum | Mon Sep 19 07:56:19 EDT 2005 | Pop
How we can improved the Solder voids on QFN Packaging. Actually we adjust the time for solking to long . But is not affected. Pls advise. ThANK YOU
Electronics Forum | Sat Apr 15 14:28:26 EDT 2006 | Dan Mendoza
This may sound like advertasing, but I ran a DOE with five solder paste/flux manufacturers and somehow, the voids went away with the AIM solder.
Industry News | 2016-04-06 12:45:01.0
The SMTA is excited to announce three new workshops for the 10th Annual International Conference on Soldering and Reliability (ICSR) being held May 9-11, 2016 in Toronto, Canada. The event is co-located with the SMTA Toronto Expo.
Industry News | 2016-04-07 09:04:01.0
The SMTA is excited to announce three new workshops for the 10th Annual International Conference on Soldering and Reliability (ICSR) being held May 9-11, 2016 in Toronto, Canada. The event is co-located with the SMTA Toronto Expo.
Technical Library | 2007-04-04 11:43:41.0
The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature.
Technical Library | 2016-05-12 16:29:40.0
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multiple HDI layers. Stacked microvias are usually filled with electroplated copper. Challenges for fabricating reliable microvias include creating strong interface between the base of the microvia and the target pad, and generating no voids in the electrodeposited copper structures. Interface delamination is the most common microvia failure due to inferior quality of electroless copper, while microvia fatigue life can be reduced by over 90% as a result of large voids, according to the authors’ finite element analysis and fatigue life prediction. This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Heller Industries Inc. | https://hellerindustries.com/voids-2/
Voids Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New! Dual Lane, Dual Temperature Reflow Oven Pressure Curing Ovens
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1620&OB=ASC.html
LGA default pad shapes - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login LGA default pad shapes
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
