New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
New Equipment | Fabrication Services
Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l
Electronics Forum | Fri Oct 28 14:09:39 EDT 2022 | ttheis
Allowing a part to go over the board boundaries can cause collisions when boards are nested. The software on these machines has limitations but it is plenty capable and rooted in preventing physical damage to the machine. Once you are familiar with t
Electronics Forum | Mon Jul 30 10:47:29 EDT 2001 | Keith E.
I am also interested in one of Anthony's questions....How is this different from other "similar" products. After having some experience with similar technology, I ask.... 1. How does your initial set-up address the fact that you are conforming to a
Industry News | 2018-10-18 10:29:29.0
The Benefits of Embedded Discrete Components
Industry News | 2018-10-18 11:09:41.0
Advantages of Design for Manufacturability Rules
Technical Library | 2017-11-08 23:22:04.0
Due to the ongoing trend towards miniaturization of power components, the need for increased thermal conductivity of solder joints in SMT processes gains more and more importance. Therefore, the role of void free solder joints in power electronics becomes more central. Voids developed during soldering reduce the actual thermal transfer and can cause thermal damage of the power components up to their failure. For this reason, the company has developed a new technique to minimize the formation of these voids during the soldering process.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Inline 3D SPI, Standard Automatic solder paste inspection system As one of the strongest SMT 3D SPI Manufacuturer in China, we provide you all the different models of online solder paste inspection machine,we have variety of size and models of the
Events Calendar | Thu Aug 23 00:00:00 EDT 2018 - Thu Aug 23 00:00:00 EDT 2018 | ,
Strain Gauge Data Can Be Misleading | Predicting Strain Levels Caused by Mounting PCBs in Housing Using the ICT Analysis Feature of Sherlock
Imagineering, Inc. | https://www.pcbnet.com/blog/causes-of-pcb-warping-how-to-prevent-it/
. This can lead to significant problems down the line: Pick-and-place machines are designed for flat surfaces. When a board has warped, these machines may inaccurately place components onto the face of a PCB
| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
. Have you ever seen this and if so, what is allowed or acceptable according to IPC standards, even with the lack of verified electrical failure of these components? Answer
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