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PB Technik supplies SMT equipment and materials to the Polish market. JUKI ERSA EKRA BRADY MARANTZ
Industry Directory | Manufacturer
RIGHT CHOICE, RIGHT PRICE, RIGHT NOW, JUST 1 CLICK ! E-MAIL: oneclickmachine@gmail.com skype : 1clickmachine Website: www.1clickmachine.com
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
New Equipment | Wave Soldering
PCB Pallet Material, Ricocel ES-3261A Sheet in Black Color Ricocel is made by fiber glass cloth and high temperature resin. It is an ideal material for solder pallets, wave solder pallets, SMT solder pallets, SMT solder fixtures, selective solder fi
Electronics Forum | Fri Jun 26 00:33:08 EDT 2020 | victorzubashev
Hello everyone, Can you please recommend a sensor to measure (contactless) level of solder inside of the wave soldering bath? ideally it should be a sensor that can reliably measure distanceto the melted solder and provide distance (as a codified si
Electronics Forum | Wed Nov 30 15:15:34 EST 2016 | warwolf
Any lead free will eat a leaded designed wave soldering machine. But SN100c will eat it the slowest, our soldering tips used to only last 3 months with SAC305 when we changed to SN100c solder wire we are having around 9 months tip life. Our wave sol
Used SMT Equipment | Soldering - Selective
Vitronics Soltec Myselective Solder Machine For Sale Clean and Excellent Working Condition! Equipment Description Vitronics Selective Solder Model Number: 6749 - My Selective Year 2006 Can Process 3 Boards at Once Internal Fluxer Preheat
Used SMT Equipment | Soldering - Wave
- Machine is available at any time, - Foam fluxer, - Single wave (laminar), - 3pcs of frame included, - Working condition. - YOM - 1995. It is filled with SN100C (106 kg) and we can provide report of test on the purity of the alloy. Equipmen
Industry News | 2018-10-18 09:33:23.0
wave soldering has become the future direction of development
Industry News | 2018-10-18 09:20:09.0
Product defects caused by the flux in the wave soldering process
Technical Library | 2023-11-14 19:24:08.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
Ultra-flexible, offline, multi-platform selective soldering system Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Pro offers the ability to regularly change solder alloys witho
High speed, in-line, multi-platform selective soldering system Incorporating high-speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offering
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Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | Dargaha Road Zameen Pallavaram Chennai, Tamilnadu India | Maintenance,Technical Support
CURRENT JOB: • Responsible for four sub department as Production support, Preventive maintenance activity, Spare parts control and NPI (New product Introduction) under one Equipment department. • Take care of OEE (Overall Equipment Efficiency), MTTR
Career Center | Dasmarinas, Philippines | Sales/Marketing
an experienced sales and marketing professional with strong background in SMT production process
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/about-us/nordson-blog/electronics-solutions-blogs/selective-vs-wave-soldering
. Additional, wave soldering disadvantages include: High solder consumption High flux consumption High power consumption High nitrogen consumption An increase in post-wave solder rework Masking of sensitive areas on PCB assemblies Cleaning of wave
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>> News Difference Between Soldering Oven and Wave Soldering Machine Difference Between Soldering Oven and Wave Soldering Machine In today's society, newer technologies are being developed every day, and these advances can be clearly seen in the manufacture of printed circuit boards (PCBs
