Electronics Forum | Mon May 21 11:14:06 EDT 2012 | joeherz
Polymide is like a sponge and absorbs moisture much faster than rigid substrates. Pre-bake your substrate for 2-4 hours at 125C and perform your soldering within 1 shift thereafter or seal in moisture barrier bags.
Electronics Forum | Fri Dec 29 08:14:19 EST 2006 | joey_dragon
Thank you for the quick reply! Actually, the "type B" I referred to applies to a flex cable that can be found in this page: http://www.tennrich.com/trtw/cabling_3.php It is a reverse Engineering project and, from what I can see, there is, indeed,
Electronics Forum | Sat Feb 12 06:10:48 EST 2011 | lafir
Flexible substrate coated by PR+, found many open trace. The Photo resist peels off from CU surface randomly creating open circuit during devolopement. Any ideas???
Electronics Forum | Mon Oct 14 11:02:57 EDT 2002 | pjc
Can someone please point me to some good technical papers on the Ag Epoxy process covering- printing, dispensing, component placement and curing and on flexible & ridgid substrates too? Are there lots of you out there doing this process? Thx.
Electronics Forum | Tue Jan 29 20:14:54 EST 2002 | davef
Please help us understand your situation better by describing the following: * Component [ie, PTH/SMT, type of component, lead finish you expected/ received, etc.] * Board type [ie, type of board FR-4/CEM/ceramic, etc.] * Solderability protection on
Electronics Forum | Tue Jun 29 16:03:57 EDT 1999 | Dave F
snip | John and Dave, | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like placing 0603's on 0402 pad
Electronics Forum | Wed Feb 23 16:49:08 EST 2000 | Dave F
John we paced through the same question recently. Both automatic dispensers and printers can be used to deposit SMT adhesive or solder paste on substrates with a relatively high component density. Dispensers are superior to printers in terms of exa
Electronics Forum | Wed Feb 23 16:49:08 EST 2000 | Dave F
John we paced through the same question recently. Both automatic dispensers and printers can be used to deposit SMT adhesive or solder paste on substrates with a relatively high component density. Dispensers are superior to printers in terms of exa
Electronics Forum | Wed Jun 30 06:28:12 EDT 1999 | Earl Moon
| | snip | | | John and Dave, | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like placing 0603'
Electronics Forum | Wed Jun 30 08:58:59 EDT 1999 | M Cox
| | | | snip | | | | | John and Dave, | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like p
