Industry News: $0.30 (Page 1 of 2)

Agilent Technologies Introduces Low-Cost DC Power Supplies with Features Typical of Costly Models

Industry News | 2008-07-08 23:32:28.0

Agilent Technologies Inc. (NYSE: A) today introduced the U8000 Series single-output, non-programmable DC power supplies, a low-cost expansion of the best-selling Agilent E3600 Series. Beyond cost savings, these DC power supplies offer excellent value with features that are typical only in costly programmable models. With power ranging from 90 W to 150 W, they are suitable for a variety of electronics-manufacturing applications and provide reliable, affordable power for educational uses.

Agilent Technologies, Inc.

BTU to Demo TrueFlat Technology for Substrate Flatness at SEMICON China

Industry News | 2018-02-19 13:46:00.0

BTU International will demonstrate its TrueFlat technology in the CohPros International Co., Ltd, booth #N2, 2613 at SEMICON China, scheduled to take place March 14-16, 2018 at the Shanghai New International Expo Centre.

BTU International

Toshiba High-brightness, White Surface Mount LEDs Provide Excellent Color Uniformity

Industry News | 2009-10-21 09:40:33.0

The daylight white TLWK1100C LED delivers luminous intensity of 1700mcd from a drive current of 20mA.

Marktech Optoelectronics

Practical Components Adds 0.3 mm Pitch Dummy CVBGA Test Vehicle to Lineup

Industry News | 2011-11-08 14:17:32.0

Practical Components introduces a dummy (mechanical sample) version of Amkor’s cutting-edge CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT).

Practical Components, Inc.

Practical Components Adds Test Board for 0.3 mm Pitch Dummy CVBGA Test Vehicle

Industry News | 2012-01-17 11:05:35.0

Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.

Practical Components, Inc.

Practical Components to Display Its Latest Products at the IPC APEX EXPO

Industry News | 2013-02-04 14:14:48.0

Practical Components and its sister company Practical Tools will exhibit in booth A16 at the upcoming IPC APEX Expo

Practical Components, Inc.

Nimbletronics Selects Scienscope X-ray to Keep up with Leading-Edge Technology

Industry News | 2017-05-08 16:50:24.0

Scienscope International today announced that Nimbletronics LLC selected the X-Scope 2000 X-ray Inspection System. The company operates out of a humidity-controlled manufacturing facility in Plano, TX, a suburb in the Dallas/Ft. Worth Metroplex. Nimbletronics is part of the 900 acre Research/Technology Crossroads (RT) district.

SCIENSCOPE International

BTU Launches New TrueFlat Technology to End Die Tilt at SEMICON Taiwan

Industry News | 2017-08-26 20:24:13.0

BTU International today announced plans to introduce its new TrueFlat technology, an optional configuration of the PYRAMAX™ convection reflow oven. The unique technology for substrate flatness will be introduced for the first time in Booth 1314 at SEMICON Taiwan, scheduled to take place Sept. 13-15, 2017 at the Taipei Nangang Exhibition Center in Taipei, Taiwan.

BTU International

BTU Picks Up Two Mexico Technology Awards

Industry News | 2018-11-16 16:35:37.0

BTU International announces that it was awarded two 2018 Mexico Technology Awards during the SMTA Guadalajara Expo & Tech Forum. The awards were presented to the company for its PYRAMAX™ Vacuum reflow oven and TrueFlat technology during a Wednesday, Nov. 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.

BTU International

Methode Electronics Inc. Press Release: Methode Electronics, Inc. Announces U.S. Restructuring

Industry News | 2008-01-28 23:09:31.0

Methode Electronics, Inc. (NYSE:MEI), today announced a restructuring at its U.S.-based automotive operations in Carthage and Golden, IL. It will also discontinue producing legacy electronic connector products in Rolling Meadows, IL.

Methode Electronics, Inc.

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