Technical Library | 2023-01-17 18:00:39.0
EQUIPMENT SUPPLIERS HAVE BECOME A RESOURCE FOR PROCESS CONTROL EXPERTISE, EVEN IN THE REFLOW OPERATION.
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2019-06-18 10:18:00.0
ACI Technologies is tasked with decapsulation of electronics components for testing and investigative purposes. In the normal method of decapsulation, an analyst will drill a small indentation, with a rotary tool, in the hermetic sealant material and then apply Nitric acid to eat through the polymeric encapsulant.
Technical Library | 2020-04-14 16:00:20.0
The number of through hole connections on a circuit assembly are decreasing with the drive toward miniaturization. When these assemblies are manufactured in high volumes the most convenient method is selective soldering. Although selective soldering is very well introduced in automotive and industrial applications it can also be a very efficient method to solder high volume consumer products.
Technical Library | 2023-09-15 10:00:02.0
Experience top-tier quality inspection with our DIP Inverted Camera Online PCBA AOI solution. Ensure flawless PCB assemblies and detect defects with precision using advanced technology. Improve efficiency and minimize production issues with this cutting-edge automated optical inspection system.
Technical Library | 2019-05-23 10:42:00.0
Why identify flux residues? The primary purpose of flux is to reduce species of metal oxides from solderable surfaces, and to act as a mechanism for lifting and removing debris. If the assembly is not properly cleaned after manufacturing, flux may continue to reduce metals and may eventually corrode the assembly. When the assembly is powered, the metal ions may precipitate along electromagnetic field lines and form dendritic shorts. In addition, the presence of residue can alter the insulation properties of a board, affect the adhesion of the conformal coating, or interfere with the moving parts of the assembly. In radio frequency (RF) applications, flux may change the RF properties on the surface of the printed circuit board (PCB) such as the dielectric strength, surface resistance, and Q-resonance.
Technical Library | 2019-09-23 09:35:00.0
Failure analysis (FA), by its very nature, is needed only when things goawry. Before any testing is performed on the sample, a decision mustbe made as to whether or not the sample is allowed to be destroyedin the process of testing. Non-destructive testing can allow for re-use of the assembly since the functionality is not altered, but there still remains the possibility that inadvertent damage can occur through the course of the analysis. If non-destructive testing is preferred, then the following types of analysis can be performed. The testing can be divided into four categories: visual, X-ray (X-ray imaging and X-ray fluorescence), cleanliness (resistivity of solvent extract, ion chromatography, and Fourier transform infrared spectroscopy), and mechanical (non-destructive wire bond pull).
Technical Library | 2021-02-20 00:55:47.0
Customers must be able to rely on accurate humidity indication as an assurance of SMD quality and fitness for processing and use. Without it, they might accept SMDs from suppliers that have already been irreparably damaged by moisture during storage or transit. Or, they might approve for processing SMDs that have been improperly or insufficiently heat-dried. Beyond the processing questions, there are financial questions: Where did the dry pack problems originate and who--supplier, customer, shipper--is financially responsible for the damaged SMDs? In response, Clariant, the originator of the color change humidity indicator card, and a member of the JEDEC's Subcommittee 14.1, "Reliability and Test Methods for Packaged Devices," created a new "non-reversible" halogen and cobalt dichloride free humidity indicator card. This HIC combines two reversible indicators (5% and 10%) with a new non-reversible (60% RH) indicator spot. (Figure 1) The 5% and 10% reversible spots work the way similar indicators do: they change color from blue (dry), to lavender, to pink (wet) to indicate humidity exposure at the indicated levels. If humidity levels drop, they will gradually revert back to blue.
Technical Library | 2015-04-23 18:48:18.0
Smart phones are complex, costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance, the complexity of mobile devices has increased immensely, with more than a 70% greater number of packages now found inside of them than just a few years ago. For instance, 1080P HD camera and video capabilities are now available on most high end smart phones or tablet computers, making their production more elaborate and expensive. The printed circuit boards for these devices are no longer considered disposable goods, and their bill of materials start from $150.00, with higher end smart phones going up to $238.00, and tablets well over $300.00.
Technical Library | 2001-05-23 17:00:44.0
The complexities of getting material ordered, manufactured and delivered overload most supply chain management (SCM) systems. The fact is, most systems are just not up to handling all the variables up and down the supply chain...
