Electronics Forum | Mon Feb 24 15:41:32 EST 2003 | davef
Larry, CSL used to publish the whole article online. Now, they just have an abstract. Bummer. Look in Circuits Assembly magazine, 12/98 for "Microcanyons"
Electronics Forum | Thu Sep 11 17:15:07 EDT 2003 | davef
We've seen two source of this: * Poor cure recipe [lookup 'microcanyon' in the fine SMTnet Archives] * Moisture absorbing glue formulations [lookup psi or aguayo in the fine SMTnet Archives]
Electronics Forum | Tue Oct 16 09:17:10 EDT 2001 | davef
Look at "Microcanyons", Circuits Assembly magazine, December 1998. There D Pauls & T Munson describe adhesive on boards that was cured too rapidly and formed a skin that trapped volatiles and solvents. The volatiles and solvents created long voids i
Electronics Forum | Wed Feb 09 21:29:28 EST 2000 | Dave F
Charlie: People cure glue using their paste reflow profile all the time. And most of them are happy. Personally, I�m with Dean and Travis. It�s possible to as you suggest, it�s appealing not to mess with your oven profile, but it just doesn�t s
Electronics Forum | Mon Mar 03 19:50:25 EST 2003 | ruggi
Hi, We dealt with and solved this problem here at Agilent...We have been doing simultaneous reflow cure in convection reflow ovens for all of the 9 years I've been here with minor problems of chips falling off, and after switching to Loctite 3609 th
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