Product name: KE - 2070 JUKI high-speed chipmounter Product number: KE - 2070 Products in detail Features: Suitable for high speed SMT chip placementmachine of small components. Not only the element corresponding to a wide rangeof laser recogniti
New Equipment | Test Equipment
IN-CIRCUIT TESTER PMP-816SII Feature ▶The instructions are synchronized with the screen results ▶Equipped with Safety Light Curtain ▶Flip door, More convenient operation ▶Double hydraulic lever, More steady operation ▶Equipped with air switch, more
Electronics Forum | Fri Jun 30 14:18:14 EDT 2006 | jdumont
We had been using the Kester Easy profile 256 paste and recently switched to the 256 HA (high activity) paste. Ive seen a reduction in shorts and better wetting on our more difficult to solder components. Both related to one another but both positive
Electronics Forum | Mon Apr 09 20:10:16 EDT 2001 | davef
Automation Group 256-858-3300 BLISS Industries 510-490-8401 EMC 215-340-0650
Used SMT Equipment | Soldering - Reflow
BTU Paragon 150 Reflow Oven Approx. Dimensions: 256" x 60" x 72" Item Location: Laval, QC Canada Features: Left to Right Edge Rail Mesh Belt
Used SMT Equipment | Flexible Mounters
Product Name: Samsung chip mounter CP45FV04 Product number: CP45FV04 Detailed product introduction Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max speed IPC9580, 14900CPH 0.178sec/chip (1608); IC flying camera 0.75s
Industry News | 2003-06-25 12:49:17.0
Additional state of the art automated surface mount assembly equipment has been installed to provide expanded capacity for advanced technology printed circuit assemblies
Industry News | 2023-08-12 13:48:10.0
In the SMT production process, considering the importance of the mounting speed of the SMT machine, many SMT machine manufacturers are making every effort to improve the speed of the SMT machine. KINGSUN technical team has analyzed the following main methods to improve the speed of the SMT machine:
 1002194 (256 theet).jpg)
Parts & Supplies | SMT Equipment
MPM Belt Modified (Groove) 1002194 (256 theet) if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Wh
Parts & Supplies | Pick and Place/Feeders
KGN-M4255-100 KGN-M4255-101 FLASH DISK FOR YAMAHA YV88XG YV100XG YV180XG YV100XTG. 256MB DISK WINDOWS SYSTEM More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Technical Library | 2016-01-12 11:01:25.0
More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper.
03047697-01 Machine controller MicroBox 420 V2 03047752-02 Inrush-current limiter 03047765-01 Transport Lock long asymmetrical compl 03047768S01 12-segm. C+P head DLM3 / w.out sleeves 03047822-01 VACUUM NOZZLE VADM-200 03047845-01
03047845-01 Cable /s-D Placementhead 03047943S01 FCCS digital 03047976S01 Cable / splice detect TC / TC-sockets 03047984-01 Vision Board Spread Spectrum X (VBSX) 03048001-02 CPU-Bg. SMP16-CPU086 1,6GHz 256MB 03048005-01 Servo amplifier TBS200/3Z
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Career Center | Huntsville, Alabama USA | Engineering,Production
Location: Colorado Description: Process engineer to support manufacturing in high volume PCB assembly facility. Requirements: Need at least three years hands on experience designing and improving manufacturing processes including screen printing
Career Center | Huntsville, Alabama USA | Engineering,Production
Location: Alabama Description: Process engineer to support manufacturing in high volume PCB assembly facility. Requirements: Need at least three years hands on experience designing and improving manufacturing processes including screen printing,
Career Center | Lapu-lapu, Cebu Philippines | Engineering,Maintenance,Production
Sept. 2, 2009 to Present, TPM2, LEAR Corporation, MEPZ-1, Lapu-Lapu City • Provides SMT engineering support to day-to-day manufacturing operations. • Handles SMT pick-and-place machine (Fuji, CP7, CP6 and QP242 Series, Universal Genesis GI-14D). •
Career Center | Lakewood, California USA | Engineering,Maintenance,Management,Production
Quality conscience, detail oriented, manufacturing engineer, with a hands on approach to overall process improvement and development. Motivated with excellent communication skills and a dedicated team player. Qualifications include: � Safety /Diver
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