Global soldering materials manufacturer founded in 1980 headquartered in IL. U.S.A. Products include: RoHS lead free solders + leaded, Metals Recycling Program, Solder Check Up Program, Technical Support. ISO 9001:2015 Certified
Qualitek International, Inc. presents Ecolloy the future of high performance lead free silver free solder. Ecolloy has a higher tensile strength and temperature cycling than SAC 305 and SnCu alloys. Melting range of this new alloy is lower than SnCu
No-Clean Lead Free Solder SAC 305 or Sn100e Kit Includes: NC611 Wire Solder Dispenser Packs (3) .015", .032" .062" Dia. Flux Core 2.2% No-Clean Rework Flux Pen Solder Iron Tip Tinner PF608 Paste Flux 10cc Syringe w/plunger 22 AWG Needles (2)
• Less then 100 hours • Stand-alone Machine • 2 Spray Nozzles/Programable • Dual Solder pots / Dual Heads – Loaded with SAC305 • Heads can run 4 different assembles • Pot level detection / Upgraded self-feeder • Automatic solder refill / Autom
Please enquire to get full documentation and set of pictures
Industry News | 2018-03-29 20:48:41.0
SMTA Europe announces Keynote Speaker Ralph Tuttle of Cree, Inc. on High Power LED Solder Joint Reliability at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2011-08-30 19:41:37.0
The SMTA announced two sessions on Alternate Lead-Free Alloys featured during their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.
Yamaha Feeder available: YAMAHA CL Feeder Part No: Yamaha CL 8*2mm Feeders for 0201 KW1-M1300-000 Yamaha CL 8*2mm Feeders for 0402 KW1-M1400-00X Yamaha CL 8*4mm Feeders KW1-M1100-030 Yamaha CL 12mm Feeders KW1-M2200-300 Yamaha CL 16mm Feeders K
Yamaha Feeder in Stock YAMAHA CL KW1-M1500-030 8MM 0201 8X2 YAMAHA CL KW1-M1400-00X 8MM 0402 8X2 YAMAHA CL KW1-M1100-000 8MM 0603 8X4 YAMAHA CL KW1-M2200-300 12MM YAMAHA CL KW1-M3200-100 16MM YAMAHA CL 24MM YAMAHA CL 32MM YAMAHA CL 44MM YAMA
Technical Library | 1999-08-27 09:29:49.0
Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...
Technical Library | 2019-01-02 21:51:49.0
Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them.
Qualitek International, Inc. presents Ecolloy the future of high performance lead free solder. Ecolloy has a higher tensile strength and temperature cycling than SAC 305 and SnCu alloys. Melting range of this new alloy is lower than SnCu alloys so it
Events Calendar | Thu Feb 25 11:00:00 EST 2016 - Thu Feb 25 14:00:00 EST 2016 | Austin, Texas USA
Understanding the Reality of New, High Reliability Solders
Career Center | Lakewood, California USA | Engineering,Maintenance,Management,Production
Quality conscience, detail oriented, manufacturing engineer, with a hands on approach to overall process improvement and development. Motivated with excellent communication skills and a dedicated team player. Qualifications include: � Safety /Diver
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder As technology becomes increasingly reliant
International Sn3.0Ag0.5Cu (SAC305) is the most popula
- $50.00 USD Quantity Add to Cart .50mm Lead Free Solder Balls (ROHS), SAC 305 250K Balls per Jar. For reballing BGA Chip. While supplies last. Call (888) 406-2830 Email: email@example.com
), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305