Industry Directory: 0.2 (6)

TaiMoon Electronics LTD.

Industry Directory |

We manufacture multi PCB up to 12 layer,The details of our capabilities:*Micro fine line to 4 mil *Blind & buried via hole *Flying-probe testing *Carbonlack *FR4 thickness: 0.3/0.4/0.8/1.0/1.2/1.5/2.0/2.4/3.2mm *Small quantities are available *Golden finger *HAL & chemical tin

New SMT Equipment: 0.2 (7808)

MALCOM STA-2 Solder Impurity Tester

MALCOM STA-2 Solder Impurity Tester

New Equipment | Solder Materials

Soldering is now lead-free. Reflow soldering quality with solder paste can be maintained by controlling the furnace temperature or determining the temperature profile on condition that the solder paste material is decided and the materials, surface t

Seika Machinery, Inc.

Hioki: FA1240 Flying Probe Tester

Hioki: FA1240 Flying Probe Tester

New Equipment | Test Equipment

Ultra-High speed measuring Measuring rate up to 40 steps per second helps reduce tact times and can actually be used in fully automated production lines averting a bottleneck. This is indeed a unique strength of Hioki’s flying probe testers. Fine pi

Seika Machinery, Inc.

Electronics Forum: 0.2 (141)

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 10:52:56 EST 2019 | jandon

Maybe something like this could work?

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o

I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.

Used SMT Equipment: 0.2 (144)

Minami Connection station

Minami Connection station

Used SMT Equipment | Conveyors

SMT connection station technical parameters: Items Normative number control system PLC control Control mode Relay sequence control Guide width 50-350mm Transmission direction L → R(R → L) Transport height 910 ± 30 mm Tra

KingFei SMT Tech

Ovation Products Reflow soldering machine  SMT  LI TUO

Ovation Products Reflow soldering machine SMT LI TUO

Used SMT Equipment | Soldering - Reflow

Reflow welding machine is a very important equipment in SMT production process. Reflow welding process directly affects the quality of SMT process. It is difficult to achieve good reflow welding quality without a good reflow A welding machine. [1]

KingFei SMT Tech

Industry News: 0.2 (124)

Europlacer to Debut iineo-II Placement System at APEX 2008

Industry News | 2008-03-04 12:05:25.0

APEX, NC - January 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its new iineo-II SMT platform in booth 1624 at the upcoming APEX 2008 exhibition and conference scheduled to take place April 1-3, in Las Vegas.

EUROPLACER

Europlacer to Display iineo-II Placement System at IPC Midwest 2008

Industry News | 2008-09-14 15:09:42.0

APEX, NC - September 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will showcase its iineo-II SMT platform in booth 423 at the upcoming IPC Midwest Conference & Exhibition that is scheduled to take place September 24�25, 2008 at the Renaissance Schaumburg Hotel & Convention Center.

EUROPLACER

Parts & Supplies: 0.2 (1175)

Panasonic 0.2 ~ 0.7MPA SMC Solenoid Valve N510063838AA CM402 / CM602 Valve VQZ1321-5M01-C6-X555

Panasonic 0.2 ~ 0.7MPA SMC Solenoid Valve N510063838AA CM402 / CM602 Valve VQZ1321-5M01-C6-X555

Parts & Supplies | Air / Vaccuum

Detailed Product Description Brand: SMC Part Name: Solenoid Valve Part Number: N510063838AA Model: VQZ1321-5M01-C6-X555 Origin: Japan Press: 0.2~0.7MPA SMC Solenoid Valve N510063838AA CM402/ CM602 Valve VQZ1321-5M01-C6-X555 Detail Information

KingFei SMT Tech

Technical Library: 0.2 (239)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Fluid Flow Mechanics Key To Low Standoff Cleaning

Technical Library | 2009-09-18 14:42:37.0

In recent years, various studies have been issued on cleaning under low standoff components; most however, with incomplete information. It is essential to revisit and describe the latest challenges in the market, identifying obvious gaps in available information. Such information is crucial for potential and existing users to fully address the cleanliness levels under their respective components. With the emergence of lead-free soldering and even smaller components, new challenges have arisen including cleaning in gaps of less than 1-mil.

ZESTRON Americas

Videos: 0.2 (113)

Universal GSM1 with FlexJet customer acceptance.

Universal GSM1 with FlexJet customer acceptance.

Videos

Universal GSM1 with FlexJet customer acceptance.

Capital Equipment Exchange

Hioki Demo

Hioki Demo

Videos

Ultra-High speed measuring Measuring rate up to 40 steps per second helps reduce tact times and can actually be used in fully automated production lines averting a bottleneck. This is indeed a unique strength of Hioki’s flying probe testers. Fine pi

Seika Machinery, Inc.

Career Center - Resumes: 0.2 (2)

resume

Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing

• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.

Glenn Brown for 3070 ICT Development

Career Center | Appleton, Wisconsin USA | Engineering,Production,Research and Development,Technical Support

I have more than 25 years of experience in electronics manufacturing and printed circuit board (PCB) structural test. My forte is in-circuit test (ICT) program and fixture development and debug on the HP/Agilent 3070. I have more than 16 years of 3

Express Newsletter: 0.2 (5)

Partner Websites: 0.2 (593)

Clariant Brochure Dispersogen PLF 100 2020 EN.pdf

| https://www.clariant.com/-/media/Files/Business-Units/ICS/Paints-and-Coatings/dispersogen_plf_100/Clariant-Brochure-Dispersogen-PLF-100-2020-EN.pdf

% 0.3% 0.3% 0.3% 0.3% 0.3% 0.3% Biocide 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% Water 35.5% 47.5% 36.5% 41.5 % 40.5% 46.5% 38.5% 52.5% 36.5 % 52.5% 19.5% 19.5% 19.5% 30.5% 25.5% 51.5% 69.5% 54.5% 53.5

DEK PARTS - QYSMT

| https://www.qy-smt.com/shop/category/dek-1113/page/38?order=name+desc

0.3 x 28 x 300mm Hot ..I PRINT 800 Squeegee blade 0.3 x 28 x 200mm Hot ..GKG squeegee blade with holes 0.2 x 29 x 620mm Hot ..GKG squeegee blade with holes 0.2 x 29 x 560mm Hot


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