Electronics Forum: 0.2 (Page 1 of 15)

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 10:52:56 EST 2019 | jandon

Maybe something like this could work?

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o

I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 18:25:07 EST 2019 | myke03o

Hi Jandon, Thanks, I will try it on my DOE.

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 21:47:41 EST 2019 | sssamw

Yes, 0.25x0.25 square could work @0.1 thickness, use nano-coating or electroform stencil for better solder paste release.

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 22:24:43 EST 2019 | dman97

Use a type 5 solder for maximum paste release.

Flux dip or solder print for CSP

Electronics Forum | Wed Feb 01 02:21:26 EST 2017 | rob

80 micrometres (0.08mm) or 80 mil (2mm)? Smallest I've seen reliably printed is around 0.2mm x 0.4mm (01005 pad) and 0.2mm x 0.2mm CSP pad, not seen anything dispensed below 0.35ish, but we are not cutting edge.

Backward compatibility in LF solder pot

Electronics Forum | Mon Jul 25 17:24:25 EDT 2005 | Kris

0.2% lead will make your solder non compliant with RoHS when you move to a completely RoHS compliant BOM. Check with your bar vendor how much it will take to convert a pot containing 0.2% lead to

Problems encountered in mounting 01005 components on 0.2mm PCB

Electronics Forum | Fri Oct 03 01:01:09 EDT 2008 | khushi

Dear All, I would like to know that what are the problems which will be encountered while mounting 01005 components & BGA's on the PCB for thickness 0.2mm and what will be the processes involved in mounting the components.

Temperature Profile for 0.2mm Thick ENIG Flex PCB

Electronics Forum | Thu Jan 30 10:12:00 EST 2020 | emeto

More detail Jinesh. Profile, datasheet of the part, stencil design, PCB finish, soldering material. Initially I am assuming you use pallet to reflow 0.2mm thick board.

Reject Rate

Electronics Forum | Mon Nov 09 15:52:42 EST 2009 | sawyer

Hi, as i know the reject rate it should be under 0,2%.

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