Ultra-High speed measuring Measuring rate up to 40 steps per second helps reduce tact times and can actually be used in fully automated production lines averting a bottleneck. This is indeed a unique strength of Hioki’s flying probe testers. Fine pi
Reworking small chip components like 01005, 0201, 0402, & 0602s are difficult and require specialized tools. Metcal has developed a technique and identified a selection of tools that enable the operator to rework these small components with repeatab
Electronics Forum | Fri Oct 03 01:01:09 EDT 2008 | khushi
Dear All, I would like to know that what are the problems which will be encountered while mounting 01005 components & BGA's on the PCB for thickness 0.2mm and what will be the processes involved in mounting the components.
1.00: 35 micron for chips & 25 micron for QFP Component range - minimum: 0.4 x 0.2 mm (01005) to - maximum: 45 x 45 mm Maximum component height: 10.5 mm (0.41”) [optional: 12 mm (0.47”) ] Automatic toolbit exchan
Board Handling Specification Minimum Size 40 x 50mm Maximum Size 510 x 508mm Thickness 0.2mm - 6mm Maximum Weight 1Kg Warpage Up to 8mm including PCB thickness Underside Component Clearance Programmable 3mm - 42mm Transport Conveyors Programma
Industry News | 2013-02-12 10:50:00.0
Europlacer a manufacturer of market-leading flexible SMT placement machines, debuts Project iico, a concept that combines outdated systems with new, innovative parts to result in an environmentally smart, technologically advanced assembly system.
Industry News | 2010-02-08 12:05:06.0
TORRANCE, CA — February 2010 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will highlight its HIOKI Flying Probe ICT with AOI functions at the upcoming SMTA Houston Expo and Tech Forum, scheduled to take place Thursday, March 4, 2010 at the Stafford Centre in Stafford, TX.
N510047259AA 480mm x 40mm x 0.2mm metal squeegee for PANASONIC SP60 SP80 Screen Printer Machine Hi Customer, We supply high quality metal squeegee for MPM/DEK/PANASONIC Printer Machine, if you need them, pls feel free to send inquiry to Becky---Be
Panasonic SMT Machine Nozzle Used for CM602 Panasonic SMT Machine Nozzle Used for CM602 Item Item Name Type OD ID Holes N610017371AC Panasonic CM-602 110S 0.6mm 0.4mm 1 N610017372AC Panasonic CM-602 115AS 0.95mm 0.65mm 1 N6100173
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2015-04-23 18:48:18.0
Smart phones are complex, costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance, the complexity of mobile devices has increased immensely, with more than a 70% greater number of packages now found inside of them than just a few years ago. For instance, 1080P HD camera and video capabilities are now available on most high end smart phones or tablet computers, making their production more elaborate and expensive. The printed circuit boards for these devices are no longer considered disposable goods, and their bill of materials start from $150.00, with higher end smart phones going up to $238.00, and tablets well over $300.00.
Suitable for diversified glass fibre board, FR-4 board, aluminum board, etc, especially for the PCB with components on both sides. If you have any question about the machine, please feel free to contact e-mial : email@example.com
5.1mm UFC-6CN5102S UFC-7CN5102S CARTRIDGE, CONICAL, 0.2mm x 5.1mm UFC-6CN5502R UFC-7CN5502R CARTRIDGE, CONICAL, BENT, 0.2mm x 5.6mm UFC-6CN5504S UFC-7CN5504S CARTRIDGE, CONICAL, 0.4mm x
& Carton PCB Manufacturing Capability Items Capability 1 Layers 1 ~ 60 layers 2 Base Material FR4, High Tg FR4, Halogen Free, Isola, Rogers, Aluminium 3 Finished Board Thickness 0.2mm ~ 8.2mm(8mil-330mil) 4 Aspect Ratio 10